国家/地区 中国（7）
IPC部 H（7）
IPC大类 H05（7） H01（6）
IPC小类 H05K（7） H01L（6）
IPC H05K001/18（6） H05K001/02（5） H01L021/48（4）
H01L023/498（4） H05K001/11（4） H05K003/00（4）
H05K003/46（3） H01L023/13（2） H01L023/14（2）
H01L023/367（2） H01L023/538（2） H05K001/03（2）
H05K003/30（2）
发明人 MOITZI H（3） MOIZY H（3） STAHR J（3）
TAY S K（2） TUOMINEN M（2） ZHENG X（2）
ZLUC A（2）
公开年 2021（7）
申请年 2020（4）  2021（3） 
专利权人 AT S AUSTRIA TECHNOLOGIES SYSTEM TEC（7）

Magnetic element used for manufacturing component carrier, comprises substantially annular structure, non-magnetic matrix, and magnetic particles embedded in matrix and matrix is electrically insulating, where matrix is diamagnetic and comprises one of temperature stable polymer.

SALKOVIC I, WEIS G, WEIDINGER G

Method for manufacturing component carrier e.g. printed circuit board, involves creating blind hole in stack towards embedded component, and extending blind hole by etching to expose surface portion of embedded component.

TUOMINEN M, TAY S K, ZHENG X

Component carrier useful as printed circuit board, comprises stack comprising electrically conductive layer structures and electrically insulating layer structure, back-drill hole, and etching neck connecting back-drill hole with end portion of vertical through-connection.

SEBASTIAN L, KASTELIC M, MARKUS K, LACKNER S

Carrier used for components e.g. camera, comprises stack comprising electrically insulating layer structure and electroconductive layer structure, heat removing and electroconductive base structure, component, and electroconductive top structure.

MORIANZ M, STAHR J, MOITZI H, MOIZY H

Connection arrangement used in component carrier comprises stack for forming component carrier structure, comprises first electrically conductive connection element, and second electrically conductive connection element.

MOITZI H, STAHR J, ZLUC A, MOIZY H

Component carrier comprises component embedded in stack and has curved surface portion, conductive contact element in contact with curved surface portion of embedded component, where stack comprises electrically insulating layer structure.

STAHR J, ZLUC A, MOITZI H, MOIZY H

Semi-flexible component carrier e.g. semi-flexible printed circuit board (PCB) has electrically insulating layer structure which forms portion of semi-flexible section in which material with elongation of greater than specific value.

XIN N, TUOMINEN M, TAY S K, XIN L, ZHENG X