国家/地区 美国（11）
IPC部 C（8） H（5） B（3）
IPC大类 C09（7） H05（3） B05（2）
C23（2） H01（2）
IPC小类 C09D（5） C09K（4） H05K（3）
B05D（2） C23C（2） H01L（2）
IPC C09D007/12（3） C09K005/14（3） C09D005/08（2）
H05K001/03（2） H05K001/09（2） H05K003/18（2）
发明人 CHANG K（11）
公开年 2017（4） 2020（2）
申请年 2014（2）  2015（2）  2017（2）  2018（2） 
专利权人 CHANG K（4） BGT MATERIAL.（3） CHEN J（3） LAI C（2）
UNIV CHUNG Y.（2）

Laser contacting process used for bonding semiconductor elements, involves controlling amount of laser light absorbed by laser control structure, and bonding contacting sections and contacting object.

JANG K S, EOM Y S, CHOI G, CHOI K, JOO J, MOON S, LEE C, CHANG K S, MUN C K, JOO J H, MOON S H, LEE C M, WEN S, ZHU Z, CUI G, YAN L, CHANG K

Perovskite optoelectronic device includes a lower electrode equipped on the substrate, an electron transport layer equipped on the lower electrode, a light absorption layer equipped on the electron transport layer and comprising perovskite.

KIM J Y, CHANG K, JI K, PARK M, PARK C R, SUNG S J, KIM J, CHANG K S, HWAN J, JIN S S

Forming electroplated copper on surface of non-metal materials by graphene-based plating ink involves preparing graphene-based plating ink, spraying plating ink on surface of non-metal material and drying ink sprayed on surface.

KU K, CHANG K, LAI C

Flexible printed circuit for use in wide range of applications, such as computers and peripherals, comprises flexible plastic substrate, where layer of functionalized graphene-based ink is attached to surface of flexible plastic substrate.

KU K, CHANG K, LAI C

Manufacturing method for polymer printed circuit board (PCB), involves forming circuit pattern of porous laser induced graphene (LIG) on polymer material layer, and depositing metal nanoparticles on LIG.

CHANG K, CHEN J, KE W, ZHANG J, LAI C

Graphene-rich baking varnish for metal surface coating, comprises graphene nanoflakes, dispersant including non-ionic/ionic dispersant, binder made of thermoplastic polymer and carrier including aqueous liquid and organic solvent.

LAI C, CHANG K, CHEN J

Graphene baking varnish used to coat a metal surface, comprises graphene nanoflakes, heat dissipation fillers e.g. tin, dispersant i.e. nonionic or ionic dispersant, binders made of thermoplastic polymers, and carriers e.g. organic solvent.

LAI C, CHANG K, CHEN J

Method for making printed graphene-based laminate for wireless wearable communications, involves drying graphene conductive ink on substrate, and compression rolling printed graphene-based laminate by using compression roller.

LAI C, CHANG K, CHEN J

Graphene glue used as adhesive to bind different components/materials together, comprises graphene including one layer, few layers and multiple layers with specified thickness and flake sizes, dispersants and carriers.

CHANG K, CHEN J, LU C

Composition used for forming anticorrosive layer, comprises polymer chosen from poly(methyl methacrylate), polystyrene, polyethylene, polypropylene, and polycaprolactone, and nanoparticles chosen from graphene and amino modified silica.

YEH J, CHANG K, HSU C, JI W, HSU M, LU H, LAI M, LIU P, CHUANG T, WEI Y, LIU W, HSIAO Y, YEH J M, CHANG K C, HSU C H, JI W F