国家/地区 韩国（11） 世界知识产权组织（4） 中国（2） 美国（2）
IPC部 C（13）
IPC大类 C09（8） C01（7） H01（5）
C08（3） H05（3）
IPC小类 C01B（7） C09D（5） C09J（4）
C08K（3） H01M（3） H05K（3）
IPC C09D007/61（4） C01B032/21（3） C08K003/04（3）
C09J011/04（3） H05K007/20（3） C01B032/05（2）
C01B032/19（2） C01B032/194（2） C09D007/40（2）
C09D175/04（2） C09J007/28（2） C09J201/00（2）
H01M004/02（2） H01M004/36（2） H01M004/38（2）
发明人 CHOI S（13）
公开年 2023（8） 2022（3） 2021（2）
申请年 2021（13）
专利权人 PURE MANN IN.（4） ELEMENT CO L.（2）

Producing coating agent used for devices, comprises e.g. preparing graphite interlayer material through electrochemical pretreatment of graphite, preparing exfoliated graphite, and preparing graphene composite through secondary exfoliation.

KYOUNGJEONGBAE, SU Y C, HWAN B J, CHOI S, BYUN G, CHOI E J

Conductive carbon-based particles used in various electronic components, comprise layer containing silver oxide, layer containing copper, and layer containing nickel or silver.

KIM S, CHOI S, CHO H, CHOI Y

Manufacture of powder coating composition for electrostatic powder coating, involves hydrolyzing jute, treating with agent comprising ammonium hydroxide and calcium sulfite, bleaching, obtaining jute-derived graphene, performing dispersion treatment, melting, and pulverizing melted material.

CHOI S

Active material used for negative electrode for lithium secondary battery, comprises silicon particles comprising coating portion derived from coupling agent, amorphous carbon portion on silicon particles, and carbon-based conductive material comprising coating portion derived from coupling agent.

KIM K B, KIM Y H, CHOI S, CHOI Y G, CHUNGRYONG M, MA Z, CHOI Y, JIN R, JIN G

Composition used in production of heat-dissipating paint, comprises binder resin comprising urethane resin or epoxy resin, thermally conductive particles comprising expanded graphite particles having preset diameter and metal particles, additives comprising anti-settling agent, and solvent.

HUN L S, SONG J, CHOI S, YUMINSOOK, KIMTAEHAN, LEE S H, SONG J H, CHOI S I, YU M S, KIM T H

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK

Electromagnetic wave shield heat dissipation adhesive sheet useful for electrical and electronic devices e.g. semiconductor chips, and chargers comprises heat dissipation layer, electromagnetic wave shielding layer and adhesive layer.

KIMTAEHAN, HUN L S, SONG J, CHOI S, YUMINSOOK, YOUK S K, SHIM Y

Graphene composite useful in an ink composition for printed electronics comprises graphene, transition metal nanoparticle and silver, where the transition metal nanoparticle carbide-bonded to surface of graphene.

CHOI S, SHIN M S, LEE S J, YEON J, OH S T

Cooling of semiconductor component for e.g. heat sink, involves arranging metal layer between component and heat dissipation coating layer, forming coating layer by using heat dissipation coating composition containing urethane binder resin, and exfoliating thermally conductive particles.

KIMTAEHAN, HUN L S, CHOI S, SHIM Y, SONG J, KIM T H, LEE S H, CHOI S I, SIM Y H, SONG J H