国家/地区 韩国（9）
IPC部 C（8） H（7） B（6）
D（2）
IPC大类 H01（7） C09（5） C08（4）
B24（3） B82（2） C01（2）
C04（2）
IPC小类 C08K（4） C09K（4） H01L（4）
B24B（3） C09G（3） B82Y（2）
C01B（2） C04B（2） C08J（2）
IPC C08K003/04（3） H01L021/304（3） H01L021/321（3）
B24B037/04（2） B82Y040/00（2） C09G001/02（2）
C09K003/14（2） H01L021/306（2）
发明人 KIM D Y（9）
公开年 2021（4）
申请年 2020（3）  2012（2） 
专利权人 SAMSUNG ELEC.（4） KOREA INST S.（3）

Production of carbon composite fiber used for e.g. aviation application, involves preparing spinning dope by dispersing carbon nanomaterial and polyamic acid in super acid, and imidizing preliminary fiber to obtain polyimide composite fiber.

KU B, KIM S Y, KIM S G, YOU N H, KIM J, HWANG J Y, KIM N D, KIM D, KOO B C, KIMRYAN, KIMSEOGYUN, KIM J W, DONG K, KIM D Y

Hollow particles used for heat-dissipation fluid composition, comprise inorganic particle layer comprising ceramic particles and conductive carbon-based particles as spherical hollow particles and having empty inner space inside, and polymer coating layer.

KWON K A, CHUN M S, KIM D Y, SEOK C M, KIM D, QUAN W, QUAN J

Carbon abrasive used to polish slurry, and manufacture semiconductor device contains carbon nanoparticle, and positively charged polymer, and/or positively charged oligomer disposed on surface of carbon nanoparticle.

TAKAI K, KIM D Y, KIM D

Chemical mechanical polishing by preparing polishing pad, positioning semiconductor structure, supplying polishing slurry between semiconductor structure and polishing surface of polishing pad and contacting to polish structure surface.

KIM D Y, TAKAI K, MOON D K, YOON M H, JUNG M I, MOON D, YOON M, IL J

Manufacturing a metal structure for metal wire which further used for semiconductor device, involves forming a metal layer comprising a metal and nano-abrasive, and supplying slurry on metal layer to perform chemical mechanical polishing.

TAKAI K, KIM D Y, YOON B, YOON B U

Field emission device for electronic apparatus has insulating spacer that forms opening that is path of electrons emitted from electron emission source, and gate electrode with graphene sheet that covers opening.

LEE D, PARK S, KIM Y, LEE C, KIM D, LEE D G, PARK S H, KIM Y C, LEE C S, KIM D Y

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN

Fabricating graphene thin film involves making graphene by reducing graphene oxide using sulfonyl hydrazide-based reducing agent, forming graphene dispersed solution by dispersing graphene into organic solvent, and applying solution to film.

NA S I, KIM D Y, KOO H Y, YUN J M, YEO J S, KIM J K

Graphene complex nanofiber used for manufacture of e.g. luminescent display, is obtained by dispersing graphene on surface of polymer nanofiber having specific thickness, or carbon nanofiber.

JANG S, PARK H, CHO S, KIM D, HONG W, LEE S, PARK T, CHOI B, PARK H S, JO S M, KIM D Y, HONG W H, LEE S Y, PARK T J, CHOI B G, JANG S Y