国家/地区 中国（13）
IPC部 C（13）
IPC大类 C09（5） C08（3） C22（3）
B22（2） C01（2） C04（2）
IPC小类 C08L（3） C22C（3） B22D（2）
C01B（2） C04B（2） C08J（2）
C08K（2） C09J（2） C09K（2）
IPC B22D017/00（2） C22C001/10（2） C22C032/00（2）
C22C049/04（2） C22C049/14（2） C22C101/10（2）
发明人 ZENG X（13）
公开年 2021（7） 2022（5）
申请年 2021（13）
专利权人

Magnesium-based composite material useful in structural member of shell of electronic device, comprises magnesium alloy matrix and reinforcing body, where magnesium alloy matrix including e.g. zinc, calcium, aluminum, zirconium, cerium, lanthanum, yttrium, neodymium, silicon, manganese, and tin.

GU L, YING T, HUANG L, ZENG X, WANG R

Preparing aerogel with double-oriented network used as heat-conducting composite material comprises mixing filler, polymer agglomerant and water, placing double-orientation molding device in refrigeration medium, adding filler mixture, freezing, freeze-drying, sintering and heat-treating.

XU J, ZENG X, SUN R, YAO Y

Heat-conducting ultra-thin grid adhesive tape used in consumer electronics products such as mobile phone, notebook computer, tablet computer, comprises predefined amounts of acrylic adhesive, tackifier, functional auxiliary agent, flattening agent, dispersant, cross-linking agent and solvent.

LIN Y, HE M, ZENG X, LI T, QIAN X

High temperature resistant pressure-sensitive adhesive protective film comprises protective film main body, buffer layer, base film layer and release film.

ZENG X

Preparing copper-coated steel corrosion-resistant conductive coating for power system, comprises e.g. pre-processing copper coated steel surface, and preparing conductive coatings in buffer solution with specific pH.

DENG C, XU B, ZENG X, HU J, JIA L, PEI F, LIU X, TIAN X

Preparing conductive sponge useful in field of pressure sensor comprises e.g. heating and dissolving elastic resin in solvent to obtain elastic resin carrier, mixing conductive filler with resin carrier, adding second solvent in mixed slurry, dipping sponge into conductive slurry, drying.

GAO F, HUANG L, HU Y, ZENG X, ZHOU H, ZHOU B

Light alloy product used in aerospace, computer, communication and consumer electronics, and automobile manufacturing applications, is prepared by melting, mixing, and injection molding solid magnesium alloy raw materials and modified materials through complete machine.

SU X, CUI T, LI Q, LIU Y, GU L, ZHANG H, ZENG X, DENG J

Preparing metal-based composite material comprises e.g. processing matrix metal material into millimeter-sized matrix alloy particles, drying, and solid mixing of matrix alloy particles and non-metal enhanced phase particles.

ZENG X, GU L, YING T

Polymer composite thermal interface material comprises crosslinking agent, lipoic acid and/or derivative, thermal conductive filler and aluminum salt.

REN L, WANG Z, YE W, ZENG X, SUN R, XU J

Cement comprises acetylene sulfide, tricalcium silicate, tricalcium aluminate, calcium aluminoferrite, zirconium silicate, low hydration active material, reinforcing agent, anti-shrinking agent and 0early strength agent.

LIU H, ZENG X, GU A