国家/地区 韩国（16） 中国（15） 美国（10） 欧洲专利局（EPO）（8） 日本（8） 世界知识产权组织（7） 印度（3） 台湾（3）
IPC部 C（27）
IPC大类 C08（27）
IPC小类 C08K（27） C08L（22） C08J（14）
C08G（6） C09D（5） C09K（4）
H01L（4） B29C（3） C08F（3）
B33Y（2） B60C（2） B82Y（2）
C01B（2） C09C（2） C09J（2）
IPC C08K003/013（27）
发明人 ALKA A（2） ALKAN A（2） ALKANE A（2）
BAYER A（2） CADALBERT A（2） CHOI Y（2）
DALBERT A（2） HOFFMANN B（2） KIM T H（2）
LEE J（2） ZHENG Y（2）
公开年 2021（19） 2022（5） 2020（3）
申请年 2020（27）
专利权人 EMSCHEM AG（2）

Polyamide molding composition used as a filled polyamide molding for producing moldings or components of automotive sector, comprises partially crystalline and aromatic polyamide, functionalized impact modifier, metallocene, and additive.

ALKAN A, CADALBERT A, BAYER A, HOFFMANN B, ALKANE A, DALBERT A, ALKA A

Polyamide molding compound used for forming e.g. component of engine compartment of automotive application, comprises partially crystalline, partially aromatic polyamide and/or caprolactam-containing polyamide, filler, optionally substituted metallocene, and additive.

ALKAN A, CADALBERT A, BAYER A, HOFFMANN B, ALKA A, ALKANE A, DALBERT A

Filler composite material used for high voltage switchgear, comprises heterogeneous material composite particles including host and guest particles comprising zinc oxide, silicon dioxide, and aluminum oxide or silicate and polymer resin.

CHAE J, LEE S, KIM Y N, AHN S, WOO K, CHOI Y

Producing polyimide aerogel used for three-dimensional model conveniently in various fields i.e. food, comprises e.g. preparing polyamic acid salt by dissolving diamine, dianhydride and tertiary amine-based photocuring agent in solvent.

CHUNG C M, CHOI Y J, CHOI J Y, JIN S W, PARK H J, SEUNGHYOUN L, LEE J S, LEE J, AHN H S, KIM D

Halide perovskite composite film useful in energy harvesting device comprises halide perovskite is dispersed in a photocurable resin, nanoparticles zinc oxide, tin zinc oxide, gallium nitride, cadmium telluride, and cadmium selenide.

KIM T H, HUN L, KIM D H

Heat dissipation composition used for forming coating agent, comprises base polymer containing silicone-based resin and filler containing at least two of expanded graphite, carbon nanotubes, graphene and metal nanoparticles.

HWANG I S, PARK Y S, HWANG I C, PARK K H, HWANGINSEONG, CHAN H, PARK K

Bulk molding compound composition for electrical article, comprises organic mixture of thermosetting crosslinkable unsaturated polyester resins and reactive monomers, low curing agent, mold release agent, flow additive, pigment paste, conductive nano-powder, and reinforcing fibrous glass filler.

GHOSH S K, MAITY S, RANE R

Silicone pad for hot press useful for preventing damage due to bending comprises pad made of silicon material set on upper and lower parts of circuit board in hot press process of forming insulating resin layer through hot press.

YOON K S, HAN Y M

Three-dimensional curvature structure comprises ink pattern printed on biaxial pre-stretched polymer sheet, and printing pattern portion containing facet on which ink pattern is printed or not, produced by deformation by differential contraction between printed and unprinted portion by stimulation.

WIE J J, KIM H R, LEE J, CHOI J, KYUNG W S

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y