国家/地区 韩国（23） 中国（21） 美国（17） 欧洲专利局（EPO）（16） 世界知识产权组织（15） 日本（11） 台湾（6） 印度（4） 德国（2）
IPC部 C（39） B（18） H（11）
F（3）
IPC大类 C08（39）
IPC小类 C08K（39） C08L（29） C08J（16）
C08G（10） B29C（8） H01L（7）
C09D（6） C09K（6） C01B（5）
H05K（5） B32B（4） B60C（3）
B82Y（3） C08F（3） C09C（3）
IPC C08K003/013（39）
发明人 ZHOU Z（3） CHIARA D（2） CHOI Y（2）
CHOI Y S（2） COSTANZA V（2） DARAIO C（2）
EBLIN J（2） EBLING R（2） HARDER P（2）
KIM T H（2） SCHUBERT C（2） VINCENZO C（2）
WANG L（2） ZHUN Z（2）
公开年 2021（39）
申请年 2020（19）  2019（10）  2021（10） 
专利权人 CALIFORNIA I.（2） EMSCHEM AG（2） EMSPATENT AG（2） SAMSUNG ELEC.（2）

Intermediate film used for laminated glasses for automobiles, railroad vehicles, aircraft, ships, and buildings, contains pigment.

NOHARA A, CHOU K, NAKAYAMA K, OKAJIMA M, CHOW K, MOYURU O A, ZHANG J, YE Y

Manufacturing interior sculptures using polymer polyurethane comprises mixing e.g. isocyanate, polyol, functional additive e.g. illite and ocher and additive e.g. glass fiber into mold, curing polyurethane resin mortar and removing mold.

KIMHYEJI, SUNG K, GON K H

Heat dissipation composition used for forming coating agent, comprises base polymer containing silicone-based resin and filler containing at least two of expanded graphite, carbon nanotubes, graphene and metal nanoparticles.

HWANG I S, PARK Y S, HWANG I C, PARK K H, HWANGINSEONG, CHAN H, PARK K

Elastomeric composition for manufacturing articles, contain carbon nanostructures or their fragments comprising multiwalled carbon nanotubes crosslinked into branched, interdigitated, entangled and/or common wall-sharing polymeric structure.

CHEN L, LI J, KYRLIDIS A, DOSHI D A, ZHANG P

Fused filament fabrication filament useful formation of component in layer-wise fashion, comprises feedstock material comprising a polyaryletherketone, and at least one filler means.

CHAPLIN A, DALLAS C, RIDOUT C, RILEY M, THORPE A

Composite useful in photoelectric device, thermal sensing device and electronic device for sensing heat or infrared light, comprises block copolymer including e.g. alkyl-based first structural unit, and polyvalent metal ion.

CHOI Y, KIM T H, WANG L, VINCENZO C, ZHUN Z, CHIARA D, DARAIO C, ZHOU Z, COSTANZA V, CHOI Y S

Bulk molding compound composition for electrical article, comprises organic mixture of thermosetting crosslinkable unsaturated polyester resins and reactive monomers, low curing agent, mold release agent, flow additive, pigment paste, conductive nano-powder, and reinforcing fibrous glass filler.

GHOSH S K, MAITY S, RANE R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Silicone pad for hot press useful for preventing damage due to bending comprises pad made of silicon material set on upper and lower parts of circuit board in hot press process of forming insulating resin layer through hot press.

YOON K S, HAN Y M

Three-dimensional curvature structure comprises ink pattern printed on biaxial pre-stretched polymer sheet, and printing pattern portion containing facet on which ink pattern is printed or not, produced by deformation by differential contraction between printed and unprinted portion by stimulation.

WIE J J, KIM H R, LEE J, CHOI J, KYUNG W S