国家/地区 中国（21）
IPC部 C（21） B（8） H（4）
IPC大类 C08（21） C09（8） C01（5）
H01（4） B29（3） B01（2）
B32（2） B33（2） B60（2）
B82（2） H05（2）
IPC小类 C08K（21） C08L（18） C08J（10）
C08G（8） C01B（5） C09K（5）
B29C（3） C09C（3） B01J（2）
B32B（2） B33Y（2） B60C（2）
B82Y（2） C09D（2） H01L（2）
IPC C08K003/013（21）
发明人 EBLIN J（2） EBLING R（2） HARDER P（2）
SCHUBERT C（2）
公开年 2021（21）
申请年 2020（10）  2021（6）  2019（5） 
专利权人 EMSCHEM AG（2） EMSPATENT AG（2）

Intermediate film used for laminated glasses for automobiles, railroad vehicles, aircraft, ships, and buildings, contains pigment.

NOHARA A, CHOU K, NAKAYAMA K, OKAJIMA M, CHOW K, MOYURU O A, ZHANG J, YE Y

Elastomeric composition for manufacturing articles, contain carbon nanostructures or their fragments comprising multiwalled carbon nanotubes crosslinked into branched, interdigitated, entangled and/or common wall-sharing polymeric structure.

CHEN L, LI J, KYRLIDIS A, DOSHI D A, ZHANG P

Fused filament fabrication filament useful formation of component in layer-wise fashion, comprises feedstock material comprising a polyaryletherketone, and at least one filler means.

CHAPLIN A, DALLAS C, RIDOUT C, RILEY M, THORPE A

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Hollow particles used for heat-dissipation fluid composition, comprise inorganic particle layer comprising ceramic particles and conductive carbon-based particles as spherical hollow particles and having empty inner space inside, and polymer coating layer.

KWON K A, CHUN M S, KIM D Y, SEOK C M, KIM D, QUAN W, QUAN J

Color masterbatch based on nano microcapsule encapsulation technology, comprises polypropylene, thermal conductivity additives, microcapsule toner, and nucleating agent.

CHEN R

Filament material for marking three-dimensional (3D) printed object, has polymer resin (compatible with extrusion based printing process), and marking additive that allows portions of filament material to change color when exposed to light.

HU N X, HU N

Composition for forming composite material, comprises polyaryletherketone copolymer comprising polyetheretherketone containing structural unit and poly(ether diphenyl ether ketone) containing structural unit, and poly(etherimide).

RICH J, ELHIBRI M J, LEACH J, ELHIBRI M

Preparing graphene-reinforced sheet molding compound composite material comprises e.g. mixing graphene, dispersant, additives, unsaturated polyester resin and curing agent and passing through winder and curing.

WANG H, NIE T, MA S, WANG G, BAI J