国家/地区 中国（5） 日本（3） 世界知识产权组织（3）
IPC部 C（10）
IPC大类 C08（10）
IPC小类 C08K（10） C08L（10） H01L（4）
H05K（3） B32B（2） C08J（2）
C09D（2）
IPC C08K005/54（10）
发明人 KIGUCHI K（2） SHIMADA A（2） TSUCHIYA H（2）
公开年 2021（3） 2022（3） 2017（2）
申请年 2019（3）  2017（2）  2020（2）  2021（2） 
专利权人 TORAY IND IN.（2）

Energy storage battery connecting cable sheath rubber material comprises e.g. polyurethane rubber, butadiene styrene rubber, ethylene propylene diene rubber-graphene mixture, nitrile rubber, sodium silicate adhesive, and hexamethyl cyclotrisilazane.

AN X, ZHONG J, ZHOU J, CHEN Q, YANG H, WANG Y, LI M

Curable composition useful as adhesive for adhering a part of a casing of a battery element to a cooling plate, comprises humidity-curable prepolymer, thermally conductive nano-filler and thermally conductive macro-filler.

GOLOMBOWSKI D, CATE P

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Cured product used for multilayer sheet, comprises composition comprising resin or resin precursor, and filler having preset aspect ratio, and has preset thermal conductivity and elastic modulus.

KIGUCHI K, TSUCHIYA H, SHIMADA A

Composition e.g. sheet-like composition for forming cured material, comprises resin containing polyimide resin, and filler containing two fillers having preset aspect ratio and average maximum length in preset volume ratio.

KIGUCHI K, TSUCHIYA H, SHIMADA A

Producing planar heating element paste composition for e.g. planar heating element, comprises e.g. heat-treating carbon nanotubes, silanizing using silane, preparing dispersion by adding carbon nanotubes having silane functional group.

HWANG K C, KIM J, BAE Y J

Improved chlorinated polyvinyl chloride power pipe comprises chlorinated polyvinyl chloride, graphene A, carbon black, coupling agent, toughening agent, compatibilizer, composite lubricant, antioxidant, and titanium dioxide.

LIU G, WANG C

Nickel-plated graphene-reinforced phenolic resin-based composite material comprises nickel-plated graphene, urea, aqueous ammonia, ammonium sulfate, silicone oil, silane coupling agent and phenolic resin.

CHEN Z, ZHANG D

Special LED lamp packaging material comprises organosilicone-modified epoxy resin, high-methyl phenylvinyl silicone resin, graphene oxide, methylphenyldichlorosilane, silica, 2,6-di-t-butyl-4-methylphenol, and butylhydroxyanisole.

FANG Z

Light-emitting diode encapsulating material comprises curing agent, graphene, epoxy resin and accelerant.

WANG H