国家/地区 美国（15）
IPC部 C（15）
IPC大类 C08（15）
IPC小类 C08K（15） C08L（10） H01B（8）
C08J（6） C09D（5） H05K（5）
B32B（4） C09K（4） H01M（4）
C01B（3） C08G（3） H01G（3）
H01L（3） B01J（2） C08F（2）
IPC C08K007/06（15）
发明人
公开年 2021（4） 2023（4） 2014（2） 2022（2）
申请年 2022（5）  2013（2）  2020（2）  2021（2） 
专利权人

Conductive rubber composition used in article, e.g. tire, tire chimney, wire, sensor, hose, and electromagnetic interference shielding gasket, comprises rubber component, and electrically conductive carbon components.

DENNISPELCHER R V, ZHAO J, MURRAY A P

Carbon nanoparticle polymer matrix composite comprises polymer matrix having multiple polymer particles, which comprises polymer and multiple interconnected electromagnetically irradiated carbon nanoparticles (CNPs) interfacially bonded to polymer matrix with consolidated morphology.

SOLOMON G H, LARSEN A G, TRUSS R W, ZHU Z, VILLACORTA H B S

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Preparing hydrogel for energy storage device, involves forming pre-gel comprising polymer and metal salt particles, shrinking and dehydrating pre-gel and impregnating shrunk and dehydrated pre-gel with ion solution to cross-link and rehydrate shrunk and dehydrated pre-gel to produce hydrogel.

JI D, KIM J Y, HWAN J D

Solid polymer conductive composite used for non-metallic aircraft fuel delivery system component, is prepared from composition comprising polyaryletherketone polymer, conductive filler, and dispersing and processing additive.

MAPKAR J A, SALUNKE N, DEMUTH M J

Carbon material dispersion liquid used for manufacturing e.g. paints, comprises carbon material containing carbon black, organic solvent, and polymer dispersant comprising amine-containing structural unit, propanone-containing structural unit, and other structural units connected to these units.

HIROYUKI S, YOSHIKAZU M, JUN K, SEIJI D, SHIMANAKA H, MURAKAMI Y, KAMABAYASHI J, DOI S

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Integrating process of electrically conductive material into surface layer of electrically conductive polymer, involves including an electrically conductive material in a polymerisation mixture, and polymerising polymerisation mixture.

HIGHGATE D J, HOWLIN B J, TANG W

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E