国家/地区 中国（9）
IPC部 C（9）
IPC大类 C08（9）
IPC小类 C08K（9）
IPC C08K007/26（9）
发明人 ZHANG T（2）
公开年 2022（5） 2021（4）
申请年 2021（5）  2022（3） 
专利权人

Preparation of electromagnetic shielding composite material used in highly integrated microcircuit electronic devices, involves mixing and stirring uncured silicone rubber liquid with chopped carbon fibers, defoaming, pouring in iron mold, and curing reacting.

DONG Y, XU L, NI Q

Wave-absorbing and light structure integrated foam material useful in the preparation of wave absorbing materials, comprises matrix resin monomer, foaming agent, initiator, crosslinking agent, tackifier, and wave absorbing agent.

HUANG Y, YUAN M, CHEN Y, ZOU H

Non-fiber reinforced fluorine-containing resin based high-frequency copper-clad plate comprises copper foils positioned on two sides of a fluorine-containing resin base plate positioned in the middle, which is prepared by using fillers such as silica, alumina, and titanate coupling agent.

XIANG Z

Preparing silicone rubber electromagnetic shielding complex material with three-layer structure comprises e.g. mixing raw silicone rubber, 2,5-dimethyl-2,5-bishexane, zinc oxide, stearic acid, and white carbon black, cutting into sheets, adhering all sheets, hot pressing, and curing.

JI Z, ZHANG M, MA J, LI X, ZHANG T, SHAO L

Silicon rubber wave-absorbing compound material useful for electronic appliance, communication, power battery, and military industry, comprises vinyl silicone oil, hydrogen-containing silicone oil, wave-absorbing filler, reinforcing filler, platinum catalyst, and inhibitor.

JIANG X, YAN X, GUO J

Silicone rubber composite material useful as electromagnetic shielding material comprises silicone rubber, silica, iron(II, III) oxide, graphene, modifiers, lubricants and crosslinking agents.

LU Y, LI Q

Low dielectric polyimide film useful in flexible printed circuit board, comprises polyimide and double-layer hollow particle, which is hollow nano-particle coated by fluorine graphene oxide.

ZHANG T, YANG F, SONG M, XIONG F, ZHANG W

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Prepreg with absorbing and electromagnetic shielding composite function comprises prepreg resin mixture comprising resin matrix, toughening agent and wave-absorbing powder, fiber layer and shielding layer.

JING D, WEI X