国家/地区 中国（27）
IPC部 C（27）
IPC大类 C08（27） C09（6） D06（2）
IPC小类 C08K（27） C08L（27） C08J（5）
C09K（4） C08G（3） C09C（2）
D06M（2）
IPC C08L063/00（27）
发明人 CHEN Y（27）
公开年 2022（8） 2018（5） 2016（4） 2015（3） 2017（3） 2021（3）
申请年 2022（5）  2018（4）  2021（4）  2014（3）  2015（3）  2016（3）  2017（2）  2020（2） 
专利权人 UNIV JIANGNA.（3） AECC BEIJING.（2） GUANGDONG PO.（2） UNIV SICHUAN（2）

Polyimide-inorganic fiber cross-linked coupling insulating pull rod, formed by compounding epoxy resin and fiber fabric layer.

XU Z, CHEN Z, CHEN Y, LIN L

Sheet molding compound material useful in e.g. chemical industry, comprises first component comprising glass fiber, and second component e.g. matrix resin, graphene, elastomer low shrinkage additive, inorganic filler, curing agent, internal release agent, mill base and thickening agent.

SUN P, HU L, WU H, CHEN Y

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y

Preparing a superhydrophobic composite material, comprises e.g. dispersing the graphene oxide-chitosan composite material in deionized water and obtaining precipitate, adding hybrid, POSSNH2 and dicyclohexylcarbodiimide into single-neck flask filled with ethanol and performing ultrasonic treatment.

GAO K, SU B, WAN H, LI J, CHEN Y, LIU Z, CHEN T

Graphene epoxy resin polymer material for plastic toy processing field, comprises epoxy resin, butyl glycidyl ether, acid anhydride curing agent, accelerator, silicone defoamer, toughening agent, silane coupling agent, dispersant, and functionalized graphene.

CHEN Y

Preparing pre-constructed three-dimensional graphene network and thermal conductive composite material comprises mixing graphene and pore-forming materials, uniformly dispersing, and compressing with specific pressure, and curing the prepreg.

ZHU J, CHEN Y, ZHANG L, JIA W, LI X

Liquid crystal polymer material having high thermal conductivity useful in electronic housings and products having high heat dissipation requirements, comprises e.g. liquid crystal polyamide or liquid crystal epoxy resin, hindered phenolic antioxidant, alumina and decabromodiphenylethane.

ZHENG F, LIANG W, ZHENG Z, ZHENG Y, CHEN Y

Low dielectric strength composite material useful in communication, preferably Fifth generation (5G) communication, comprises e.g. thermotropic liquid crystal polymer material, thermosetting resin, silane modified nano boron nitride powder, hydroxy modified graphene and inorganic filler.

ZHENG Y, ZHENG F, CHEN Y, LIANG W, ZHENG Z

Preparation method of graphene prepreg for anti-lightning strike, involves using graphene prepreg made of semi-cured resin particles and graphene powder as raw material, mixing by solution, drying, and performing hot-melt compounding process for continuous preparation.

CHEN Y, ZHAO S, LIU Q, ZHANG D, CHEN X

Low conductivity temperature coefficient epoxy resin nano composite insulating material useful in direct current power systems insulation materials comprises graphene oxide, epoxy resin, and curing agent.

YANG W, YIN L, YAN B, CHEN Y, CHEN X, ZHANG C, ZHANG Z, WANG K, SUN H, DU B, KONG X, LI J, WANG Y