国家/地区 中国（8） 韩国（3） 世界知识产权组织（3）
IPC部 C（12）
IPC大类 C08（12）
IPC小类 C08L（12） C08K（10） C08J（5）
C09D（5） C09K（5） C08G（2）
C09J（2）
IPC C08L063/00（12）
发明人 SONG J（3） LEE E J（2） LEE K（2）
LEE K D（2） NAM C R（2） SEO M K（2）
SONG J H（2）
公开年 2023（12）
申请年 2022（9）  2023（2） 
专利权人 HANSOL CHEM .（2）

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Preparing insulating and heat-dissipating paint by adding resin diluent and solvent to matrix resin, stirring, adding amine neutralizer, additives, fumed silica, silane coupling agent and insulating and heat-dissipating fillers to pretreated matrix resin, stirring and combining with ground carbon.

LIN Y, LI K

Composition used for forming coating material, comprises curable resin and/or its precursor, inorganic particles, and graphene having preset average thickness.

KATO T, TAMAKI E

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Silicone foam sheet comprises silicone resin composition modified chitosan sol solution, where silicone resin composition includes carbohydroxy modified organopolysiloxane, epoxy resin, polylactic acid, alkyl phenol polyoxyethylene ether, sodium bicarbonate, water and zinc stearate.

CHEN C, LIN J

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Aging-resistant invisible car coating film with self-repairing function to protect vehicle paint, comprises base film layer comprising thermoplastic polyurethane coating resin, transparent soft glue, calcium carbonate, aluminum oxide, graphene, and barium zinc stabilizer, and self-repairing layer.

WEI X

Modified inorganic particle useful in preparing epoxy resin, prepared by e.g. modification of tannin-based aqueous derivatives and carbon black, carbon nanotubes, ultrasonically dispersing tannin-based aqueous epoxy-modified nanoparticle in water and post-processing.

NIE X, HUANG J

Hollow micro-sphere composition heat-conducting covered filler by low-dimensional nano-high heat-conducting material useful in heat-conducting aspect, comprises nano-high heat-conducting material comprising electrostatic interaction, chemical bond action and solvent hydrogen bond interaction.

LIU T, HUANG X