国家/地区 中国（47）
IPC部 C（47）
IPC大类 C08（47） C09（8） H05（7）
B29（6） B32（5） D06（2）
H01（2）
IPC小类 C08L（47）
IPC C08L063/00（47）
发明人 CHEN C（3） HE J（3） LI Y（3）
WANG J（3） WANG Q（3） WANG S（3）
ZHANG W（3） ZHANG X（3） CHEN S（2）
DAI M（2） HONG X（2） HUANG X（2）
LI G（2） LI J（2） LI W（2）
公开年 2023（47）
申请年 2022（38）  2023（8） 
专利权人 CHANGSHU SHE.（2） LANZHOU CHEM.（2） SHENGYI TECH.（2） UNIV ZHEJIAN.（2）

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Polyamideimide composite material useful for sealing valve body, comprises silicon dioxide/polyamide-imide composite material, epoxy resin, carbon fiber, acetone, dibutyl phthalate, graphene, vulcanizing agent, accelerators, and anti-aging agent.

TAO F, ZHU J

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Graphene oxide modified epoxy resin used as composite material resin matrix, coating, and insulating material in aerospace field, compirses graphene oxide as filler and adds it to epoxy resin matrix to form composite material system, and prepares corresponding graphene oxide-modified epoxy resin.

ZHANG F, WU Z, WEI T, LIU L, MA B, CHANG Y, WANG Q, WANG F, CHEN W, LI J, HUANG Z, BEI Y, LIN P

Interlayer modification of fiber-reinforced composite material comprises e.g. mixing and heating graphene oxide, amino-terminated silicone oil, amino-containing silane coupling agent and reaction solvent through heater, and reacting to obtain modified graphene oxide.

WU L, WANG J

High-strength polyethylene foamed cable material comprises e.g. polyethylene foam material, low-density polyvinyl chloride resin, additive, polyvinyl chloride resin micropowder, foaming agent, epoxy resin filler, nano-polytetrafluoroethylene powder, and reducing agent.

LUAN R, WANG S

Preparing insulating and heat-dissipating paint by adding resin diluent and solvent to matrix resin, stirring, adding amine neutralizer, additives, fumed silica, silane coupling agent and insulating and heat-dissipating fillers to pretreated matrix resin, stirring and combining with ground carbon.

LIN Y, LI K

Preparing polyphenylene oxide resin-based copper clad laminate comprises taking glass fiber cloth and impregnating a glue solution, drying to obtain prepreg, taking 5-10 sheets of prepregs, laminating them, and covering piece of copper foil on both sides of laminated prepregs.

XIE J, WANG X, WU H

Preparing medicine packaging composite film with super peel strength used in medicine industry, by adding high-pressure polyethylene and linear low-density polyethylene in mixer, carrying out high-speed mixing, screw extrusion molding, cooling, modifying and ultrasonically processing.

SUN E, SUN Z, LI W, SHI S, ZHANG L

High modulus thermoplastic epoxy resin composition comprises polyurethane modified epoxy resin, chain extender, spherical filler, cyclohexanone, coupling agent, nucleating agent, wetting and dispersing agent.

ZHANG X, YU J, GUO Y