国家/地区 中国（21）
IPC部 C（21）
IPC大类 C08（21）
IPC小类 C08K（21） C08L（21） C08J（10）
C08G（4） B32B（3） H05K（3）
C09K（2） D06M（2）
IPC C08L063/02（21）
发明人 LIU Y（4） CHEN Y（2） XING X（2）
ZHANG X（2）
公开年 2022（17） 2023（4）
申请年 2022（21）
专利权人

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Preparing nanocellulose/graphene/epoxy resin composite material, comprises e.g. dispersing graphene into aqueous solution of nanocellulose nanocrystals, performing high-speed shear dispersion, adding nanocellulose fiber slurry into it, dispersing, drying, infiltrating it, and curing.

YAO J, LIU H, ZHOU L, WANG F

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Epoxy resin composite material with low viscosity and high mechanical strength for preparing high performance epoxy system with low viscosity and high mechanical strength comprises epoxy resin, curing agent, multidimensional composite dispersion liquid and reinforcing agent.

CHENG J, CHEN Y, ZHANG J

Thermally-conductive epoxy resin circuit board e.g. epoxy resin copper-clad circuit board, comprises epoxy resin insulating layer containing white graphene material.

CHEN M, LIU J, JIANG J

Preparation of modified carbon fiber used as reinforcing material, involves dipping desized carbon fiber in pyrenebutyric acid polyethylene glycol aqueous solution, soaking in graphene oxide water suspension, and drying.

SUN S, LI H, LIU Y, GUO Z, AO Y, MA J, JIN L

Epoxy resin composite comprises epoxy resin, modified graphene oxide, curing agent, and accelerator, in which modified graphene oxide is obtained by mixing grafted graphene and dimethylformamide, ultrasonicating, adding modified substance, heating, cooling, centrifuging, and washing.

WANG C, MENG B, CUI Y, SI Z, LIU Y, YUAN C, AI M, WANG Z

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Method for preparing heat-conducting composite material used in electronic device comprises filling wax graphene sheet particles wrapped with wax in resin material, melting and blending to obtain heat-conducting composite material.

ZHOU M, PAN Z, ZHANG X