国家/地区 中国（29）
IPC部 C（29）
IPC大类 C08（29） B32（4） D06（4）
IPC小类 C08K（29）
IPC C08L063/02（29）
发明人 LIU Y（4） ZHANG X（4） CHEN Y（3）
LIANG M（3） QIU B（3） SUN T（3）
ZOU H（3） HAN G（2） WANG W（2）
XING X（2） ZHANG Y（2）
公开年 2022（29）
申请年 2022（17）  2021（11） 
专利权人 UNIV SICHUAN（3）

Thermally-conductive epoxy resin circuit board e.g. epoxy resin copper-clad circuit board, comprises epoxy resin insulating layer containing white graphene material.

CHEN M, LIU J, JIANG J

Preparation of modified carbon fiber used as reinforcing material, involves dipping desized carbon fiber in pyrenebutyric acid polyethylene glycol aqueous solution, soaking in graphene oxide water suspension, and drying.

SUN S, LI H, LIU Y, GUO Z, AO Y, MA J, JIN L

Epoxy resin composite comprises epoxy resin, modified graphene oxide, curing agent, and accelerator, in which modified graphene oxide is obtained by mixing grafted graphene and dimethylformamide, ultrasonicating, adding modified substance, heating, cooling, centrifuging, and washing.

WANG C, MENG B, CUI Y, SI Z, LIU Y, YUAN C, AI M, WANG Z

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Lightweight high-strength electromagnetic shielding composite material based on conductive hollow microspheres used in electromagnetic wave absorption and shielding, comprises resin substrate and conductive microsphere doped in resin substrate.

ZHANG J, HAN G, JIA Q, AN Z

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Method for preparing heat-conducting composite material used in electronic device comprises filling wax graphene sheet particles wrapped with wax in resin material, melting and blending to obtain heat-conducting composite material.

ZHOU M, PAN Z, ZHANG X

Preparation of modified epoxy composite material for marine environment, involves mixing curing agent, plasticizer, graphene nanosheet composite powder and diluent, mixing epoxy resin with obtained modified curing system, and curing obtained modified epoxy composite system.

WENG L, WANG X, CAO H

Covering film for heat conducting and electromagnetic shielding, comprises epoxy resin, composite filler which is modified nano cellulose, modified graphene oxide and carbon black, and auxiliary agent.

LIU Y, WEI C, GU H

Continuous carbon fiber reinforced thermosetting resin prepreg for three-dimensional printing, has carbon fiber bundles, thermoplastic rubber and thermosetting resin arranged, and carbon fiber bundle formed by bonding carbon fiber with binder.

HU Q, LI D, ZHANG H