国家/地区 中国（14）
IPC部 C（14）
IPC大类 C09（14） C08（3） H01（2）
IPC小类 C09J（14） C08G（3） C08L（2）
IPC C09J009/02（14）
发明人 WANG Y（3） YANG J（3） JIANG L（2）
MA A（2） WANG L（2） ZHANG Y（2）
公开年 2020（7） 2019（6）
申请年 2019（14）
专利权人 SUZHOU TONGL.（2）

Electroconductive composition used as interconnection material to connect solar cells into photovoltaic module, comprises silicone resin, silicone crosslinker, electroconductive particles, solvent, adhesion promoter, catalyst, and inhibitor.

HENCKENS A, THEUNISSEN E, YANG J, ZHANG Y, CHEN Y

Conductive binder for touch screen production, comprises functionalized graphene, acrylic resin, conductive particles, organic solvent, photoinitiator, latent curing agent, and bonding resin.

SI R, LIU C

Graphene/polyurethane sponge used for modifying polysulfide sealant, is fully immersed in polyurethane sponge in graphene oxide dispersion liquid containing reducing agent ascorbic acid.

CHEN P, TAO W, ZHOU Y, NIE W, XU Y, ZENG S

Graphene polyurethane includes components, comprises saturated monomer or unsaturated monomer, rosin resin, terpene resin, novolac resin, butanediol, glycerin, triethanolamine, and dichloro diaminodiphenylmethane.

JIANG L

Graphene glue comprises e.g. bisphenol glycidyl ether epoxy resin, polyphenol type glycidyl ether epoxy resin, heterocyclic mixed epoxy resin, reactive diluent, toughener, graphene, carbon nanotubes, curing agent and curing accelerator.

JIANG L

Preparing graphene oxide-ammonia-hydroquinone conductive adhesive comprises e.g. mixing aqueous graphene oxide solution, aqueous hydroquinone solution and aqueous ammonia, then applying to the interface of the conductor, and heating.

CUI D, ZHANG F, LU Y, ZHANG D, YANG J, JIAO J, WANG Y, GE M

Conductive silver paste for electronic resonator, comprises silver powder, graphene gel, epoxy resin, phenolic resin, polyamide resin, diluent, curing agent, accelerator, coupling agent, additives.

WANG Y, LI H, YU J, LIU J, YANG J, XU X

Conductive adhesive used for bonding fuel cell bipolar plates, comprises epoxy resin, polyimide, graphene, conductive carbon black, curing agent, liquid polysulfide rubber and curing accelerator.

ZHENG F, LIU Q, KAN J, DONG H, WU H

Heat-resistant phenolic resin-epoxy resin composite conductive glue comprises epoxy resin, phenolic resin, plasticizer, diluent, flaky copper alloy, spherical copper alloy, graphene and curing agent.

MA A, CAO W, JIAO Q, WANG L, XIAO X, LIU B, HE J

Environmentally friendly high and low temperature adhesive useful for electronic products, comprises e.g. aqueous polyurethane, modified rosin resin, vegetable gum, ethylene-acrylate-maleic anhydride copolymer and graphene dispersions.

CHEN Q