国家/地区 中国（63） 韩国（6） 世界知识产权组织（6） 欧洲专利局（EPO）（3） 日本（3） 美国（3） 台湾（2）
IPC部 C（70）
IPC大类 C08（70）
IPC小类 C08K（70） C08L（64） C09K（58）
C08J（22） C09D（9） C08F（5）
H05K（5） B29D（4） B32B（4）
C01B（4） C08G（4） H01M（4）
B29C（3） A61L（2） B82Y（2）
IPC C08K003/28（70）
发明人 LIU Y（5） ZHANG Y（4） LI J（3）
MA Q（3） QU B（3） XU H（3）
XU W（3） ZHU Y（3） AN D（2）
CAI X（2） CHEN Y（2） CHENG Y（2）
DI L（2） FAN Y（2） GUO H（2）
公开年 2021（19） 2022（16） 2018（8） 2017（7） 2019（6） 2020（6） 2023（4） 2016（2）
申请年 2021（14）  2020（13）  2022（13）  2019（9）  2017（8）  2018（6）  2016（4） 
专利权人 DEYANG ZHONG.（2） ELEMENT CO L.（2） JIANGSU JIAN.（2） NINGBO INST .（2）
SHANGHAI ALL.（2） TONGLING TON.（2） UNIV SOUTH C.（2）

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Flexible high latent heat low temperature phase change energy storage gel useful for preparing temperature-regulated materials, comprises phase change material, first hydrophilic monomer and second hydrophilic monomer, where phase change energy storage gel is prepared by in-situ polymerization.

FEI Z, WENG L, YIN C, SHI L

High thermal conductivity composition useful for preparation of thermally conductive materials, comprises grafted resin, curing agent e.g. cetyl ammonium bromide, thermally conductive filler e.g. aluminum oxide and modified graphene oxide.

YANG X, WAN F, TAN P

High enthalpy value aqueous heat-conducting phase change material comprises paraffin, melamine, ethanol mixture, aqueous polyurethane resin, polyethylene terephthalate release film and heat conducting filler comprising alumina, boron nitride, aluminum nitride or graphene.

LU Q, ZHANG W, SUN B

Folding, bending and stretching flexible high heat conducting film useful in chips, comprises graphene-based materials, acrylate group, film-forming auxiliary agent and heat-conducting filling material comprising graphene oxide, aluminum nitride or boron nitride or aluminum nitride and boron nitride.

ZHAO L, ZHANG L

Graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility comprises first dispersion solution is dispersed and second dispersion solution in which ceramic heat-dissipating filler is pulverized.

KYOUNGJEONGBAE, CHO J I, YANG H J, SONG H, SU Y C

Producing graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility, comprises preparing first dispersion solution by dispersing graphene interlayer material in aqueous solvent.

KYOUNGJEONGBAE, SU Y C

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

Preparing carbon-based aerogel-supported modified polyethylene glycol composite phase change material useful in in battery thermal management, comprises e.g. dispersing nano-particles in organic solvent, adding molten polyethylene glycol and mixing with aerogel, and performing vacuum impregnation.

WANG Y, HU J

Preparation of flexible heat accumulation heat-conducting sheet for electronic products, involves mixing and heating flexible base material, heat-conducting filling particles and phase change material, and immersing metal foam in obtained slurry, vacuum defoaming, hot-pressing and curing.

SUN Z, FANG J, REN S