国家/地区 中国（12）
IPC部 C（12）
IPC大类 C08（12）
IPC小类 C08L（12）
IPC C08L079/08（12）
发明人 CHEN K（3） YU D（3） ZHOU J（2）
ZOU H（2）
公开年 2022（12）
申请年 2021（5）  2022（5）  2020（2） 
专利权人 ITEQ WUXI EL.（3）

Liquid crystal polymer single-sided copper clad laminate useful in technical field of preparing copper-clad laminates, comprises LCP mixture layer and copper foil layer sequentially from top to bottom.

WANG Y, LIU C, XU S

Preparing high thermal conductivity electromagnetic shielding polyimide co-carbonized carbon fiber complex material useful in military, comprises e.g. preparing modified polyamic acid spinning fiber felt, immersing in high-performance resin, and post-processing.

LI X, DING P

Preparing long-life flexible circuit board comprises adding dimethyl sulfoxide into stirring tank, coating mixed solution on template by casting coating film, soaking in imidization solution, and utilizing punching device for punching and slicing flexible circuit board after curing.

CHEN Y, LU D, WU A, HU X, ZHOU J

Preparing aerogel with electromagnetic shielding and sound absorption functions useful in aerospace fields in complex environments, comprises e.g. preparing aramid nanofiber dispersion liquid, preparing polyimide precursor polyamic acid, dissolving in deionized water, and mixing conductive filler.

YAO J, YANG F, ZHOU J

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

New low-dielectric polyimide useful in preparation of low-dielectric polyimide film for electronic packaging.

QIAN X, LIAO B, ZHANG B

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Preparing ultra-light polyurethane imide material porous comprises e.g. adding pyromellitic dianhydride and methanol to dimethylformamide to dissolve, adding conductive carbon material castor oil, ionic water, silicone oil, tertiary amine catalyst and organic tin catalyst and stirring.

WU Q, SHI R, LI C, QIN L, ZOU H, LV X, YAO A, SHU Q

Use of electromagnetic material modification method in preparing polyimide foam electromagnetic shielding material.

SHI J, YANG D, CHAI X, LU X, DING Z