国家/地区 中国（8） 日本（6） 世界知识产权组织（4） 韩国（3） 台湾（3）
IPC部 C（11）
IPC大类 C09（11） B32（5） H01（4）
H05（3） C08（2）
IPC小类 C09J（11）
IPC C09J201/00（11）
发明人 ICHIKAWA I（3） ISAO I（3） TAKEO Y（3）
YOSHINOBU T（3） FUKUHARA K（2）
公开年 2022（11）
申请年 2021（6）  2020（4） 
专利权人 LINTEC CORP（3） TOYO INK SC .（2）

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

Gel nail sticker comprises adhesive layer containing adhesive component and graphene having preset size, printed layer including pattern and transparent coating layer containing ultraviolet-curable resin.

KOH S W

Negative ion functional plate comprises upper surface layer plate, lower surface plate and core layer plate, and rubber layer capable of releasing negative ion.

YUAN C, HAO X, CHEN J, SHI L, ZHANG W, WANG H, LI Q, ZHANG J, YUAN S

Power generation device used for forming battery, has structure having electrolyte and pair of electrodes arranged on structure, where pair of electrodes has conductive hot melt layer containing conductive filler and thermoplastic resin.

FUKUHARA K

Adhesive tape used for electronic products, comprises release layer, adhesive layer, base material layer, antioxidant layer, buffer layer, flame retardant layer, antistatic layer and insulating layer.

GU L

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Hybrid adhesive composition useful for electromagnetic wave shielding, comprises conductive metal particles, graphene, adhesive resin and curing agent, where graphene is chemically modified graphene, and adhesive resin is bonded to functional group of chemically modified graphene.

KIM M G, HONG S M, OH J T, KIM J H, KIM J, OH J, HONG X, KIM M, MYEONGGI K

Seed crystal adhesive used for seed crystal bonding, comprises adhesive and graphene.

HUANG X, ZHAO X, LUO Y, YANG M

Glass fiber cloth reinforced thermosetting copper-clad plate comprises glass fiber cloth, and copper foil bonded with resin adhesive on one or both sides of glass fiber cloth, the resin adhesive is formed by mixing adhesive and flame retardant and surface of copper foil is coated by coating.

CHEN M, WANG L, HE W, ZHAN H