国家/地区 中国（11） 日本（8） 美国（8） 世界知识产权组织（8） 韩国（6） 台湾（6） 欧洲专利局（EPO）（4）
IPC部 B（19）
IPC大类 B32（19）
IPC小类 B32B（19）
IPC C23C014/06（19）
发明人
公开年 2016（3） 2021（3） 2012（2） 2013（2） 2018（2）
申请年 2015（3）  2018（3）  2011（2）  2013（2）  2020（2）  2021（2） 
专利权人 EV GROUP THA.（2）

Producing food packaging barrier film used for consumers to clearly see content of packaged goods, involves providing base film, depositing inorganic laminated film on surface of base film, where inorganic laminated film includes at least one first and second inorganic material deposition layer.

CHEN C, TSAO C, LIAO T, LIAO T C, TSAO C C, CHEN C H, CHEN Z, CAO J, LIAO D

Laminate used for electronic device such as display device, comprises substrate, layer containing compound having condensed polycyclic hydrocarbon structure, and layer containing conductive material.

NAOYA N, KAZUNORI T, NOSAKA N, TAKANASHI K

Carrier substrate for transferring transfer layer from carrier substrate to product substrate, comprises carrier base substrate, protective layer, and transfer layer grown on protective layer.

BURGGRAF J, JUERGEN B

Method for transmitting a transmission layer from a substrate, such as graphene layer, to a carrier substrate, such as glass substrate and ceramic substrate, involves transmitting a graphene layer from substrate to carrier substrate.

MOKKAPATI V R, POVAZAY B, UHRMANN T, ULLMANN T, MOKKAPATI V R S S, SARMA M V R, THOMAS A

Flame-retardant and environmentally friendly plastic includes PC plastic base layer, first cubic boron nitride flame-retardant layer arranged on upper surface of PC plastic base layer.

LI Z, ZHOU B, SHEN T

Graphene laminated substrate for thermal radiation equipment, comprises graphene with equalized anisotropy, and amorphous carbon film or boron nitride film provided on each opposite surface perpendicular to lamination direction.

TATSUTA M, FUJIWARA K

High-heat radiation thin film for use as heat radiation material for e.g. electronic device, comprises carbon layer arranged on metallic board, where thickness of metallic board is specific value and carbon layer is made up of graphene.

MIN E H, CHO S H, CHOI B K, HONG M E, HO C S, KEUN C B, CHO S

Preparing graphene/metal composite material useful for high speed train insulated gate bipolar transistor packaging comprises e.g. preparing graphene oxide dispersion, coating layer of metal boron and titanium on surface of graphene film.

CHU K, WANG F, HUANG D, LI Y

Manufacture of graphene barrier film for e.g. electronic device, involves forming graphene precursor layer on catalyst layer, forming graphene layer and protective layer, removing catalyst layer and providing graphene layer to substrate.

KIM M J, SEO T H, LEE S, KIM S M, AHN S, BAE S, SON D I

Manufacture of graphene substrate involves laminating layer comprising catalytic metal, laminating layer on surface side of above layer, heat treating obtained layer, and cooling to form graphene between substrate and layer.

NARUTSUKA S, YAMADA J