国家/地区 美国（45）
IPC部 C（45）
IPC大类 C09（45）
IPC小类 C09D（45）
IPC C09D011/52（18） H05K009/00（15） C09D005/24（14）
C09D011/037（13） C08K003/04（12） H05K001/09（11）
H05K003/12（11） B82Y040/00（10） H01B001/24（9）
B82Y030/00（8） C01B031/02（8） C01B031/04（8）
C01B032/182（8） C09D005/32（8） C09D007/12（8）
发明人 JI S Y（4） KIM S H（4） HAM S J（3）
JANG B Z（3） CHEN Z（2） CHI S（2）
ELKADY M F（2） HASEGAWA S（2） HASEGAWA SHOJI（2）
HSIEH C（2） KAMIYA N（2） KAMIYA NAGISA（2）
KANER R B（2） KAVANAUGH J（2） KIM S（2）
公开年 2021（11） 2015（7） 2018（5） 2022（5） 2013（3） 2014（3） 2016（3） 2012（2）
申请年 2014（6）  2019（5）  2020（5）  2021（5）  2012（4）  2013（4）  2017（4）  2022（4）  2016（3）  2015（2） 
专利权人 SAMSUNG ELEC.（4） ANJU SCI TE.（2） BOEING CO（2） ENERAGE INC（2）
GLOBAL GRAPH.（2） GRAPHENE PLA.（2） GRAPHENE PLA.（2） HEWLETTPACKA.（2）
NANOTECH ENE.（2）

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Heating apparatus like stoves, comprises body, chamber defined by body, where chamber comprises upper region and lower region, and thermal plate that provides heat to chamber, where thermal plate comprises coating having thermo-resistive layer comprising polymeric portion and nanostructure portion.

KHIZAR M, FRACCON S

Composition for use in three-dimensional printing of electronic devices, comprises at least triphenylamine which is used as a powder binding agent in the composition, where the composition is to be melted and extruded on a structure.

GLENN C M

Electromagnetic wave absorption structure comprises electromagnetic wave composite absorbing layer, where electromagnetic wave composite absorbing layer comprises conductive composite layer and insulating layer, and insulating layer is stacked and overlapped with conductive composite layer.

WU F

Carbogenic nanoparticle-conducting polymer composite ink for thin film coated printed circuit board, dispersed in water, where carbogenic nanoparticle is reduced graphene oxide, and composite ink includes e.g. graphene oxide-polypyrrole composite ink and carbon quantum dots-polyaniline composite ink.

BHATTACHARJEE L, SHARMA A, MANNA U, GOEL A, PAL B, BESSEMER C

Electromagnetic interference shielding material useful for EMI shielding applications on electronic devices and circuit boards, comprises biopolymer or polymer dissolved in organic solvents, and shielding guest materials comprising particles, powders, tubes or rods, flakes, fiber or sheets.

GROTE J G, SALOUR M M, ZANG D Y

Invisible ice-covering-proof compatible material useful as surface material of equipment, comprises insulating and heat insulating layer comprises e.g. polyimide, glass fiber, hollow glass microsphere and/or polyurethane and patterned heating, insulating heat conducting and hydrophobic layer.

MA Z, ZHAN X, WANG Z, ZHAO Z, ZHU Y, CHEN J, LIU X, CHEN H

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K