国家/地区 韩国（18）
IPC部 C（18）
IPC大类 C08（18） C09（11） C01（4）
H05（4） B32（2） F21（2）
IPC小类 C08K（18） C08L（8） C09K（7）
C08J（6） C01B（4） H05K（4）
C09D（3） B32B（2） C08G（2）
F21V（2）
IPC C08K003/38（18）
发明人 KYOUNGJEONGBAE（3） KIM S W（2） LEE E J（2）
LEE K（2） LEE K D（2） LIM J J（2）
NAM C R（2） SEO M K（2） SONG J（2）
SONG J H（2） SU Y C（2）
公开年 2021（6） 2022（6） 2023（4）
申请年 2022（6）  2021（5）  2020（4） 
专利权人 ELEMENT CO L.（3） HANSOL CHEM .（2） LASER LIGHTI.（2）

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Antibacterial sheet used for furniture surface finishing applications, comprises substrate layer, and UV coating layer, in which graphene mixture of graphene produced by mechanical exfoliation method and hexagonal boron nitride is dispersed.

YOUNGSOOSHIM

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility comprises first dispersion solution is dispersed and second dispersion solution in which ceramic heat-dissipating filler is pulverized.

KYOUNGJEONGBAE, CHO J I, YANG H J, SONG H, SU Y C

Producing graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility, comprises preparing first dispersion solution by dispersing graphene interlayer material in aqueous solvent.

KYOUNGJEONGBAE, SU Y C

Phase change material composite material useful for constant temperature and constant humidity air ventilation system comprises support made of porous material, phase change material e.g. polyethylene glycol, and thermally conductive filler.

KANG T, LEE H S, KANG D S, YANG S Y

Heat dissipation and electromagnetic wave shielding composite material useful for electronic device package comprises electromagnetic wave shielding layer disposed between first insulating layer and second insulating layer.

NAM J, SEOL M, HWANG E, PARK I

Composite material useful as structural material and coating layer material applied to parts of electronic devices, comprises surface-modified inorganic compound and polymer resin matrix which is mixed with inorganic compound.

SHIN C M

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T