国家/地区 美国（8） 中国（5） 世界知识产权组织（5） 欧洲专利局（EPO）（4） 韩国（4） 日本（3） 澳大利亚（2） 香港（2） 台湾（2）
IPC部 F（10）
IPC大类 F28（10）
IPC小类 F28F（10） H01L（7） H05K（5）
B32B（3） B82Y（3） C01B（2）
C09K（2） F28D（2）
IPC F28F021/02（7） H01L023/373（5） H05K007/20（5）
B32B007/12（2） B82Y030/00（2） B82Y040/00（2）
C01B031/04（2） C09K005/14（2） F28F013/18（2）
H01L000/00（2） H01L023/36（2）
发明人 JANG B Z（2） ZHAMU A（2）
公开年 2014（10）
申请年 2013（10）
专利权人 JANG B Z（2） NANOTEK INST.（2） ZHAMU A（2）

Thermal interface material (TIM) pad for dissipating heat from component in electronic device such as data storage device, has TIM layers, and graphene layer which is interposed between TIM layers.

MATAYA R A, SALESSI N M, SALEESI N M

Method for manufacturing radiant heat sheet of heat dissipation device, involves forming composite dispersed solution in inner side of adhesive part, where heat dissipation films are made of graphene and carbon nanotube.

PARK Y S, PARK Y

Integrated heat sink used in e.g. electronic device, has heat sink formed of nano graphene platelet-reinforced composite having discrete nano graphene platelets or sheets (NGPs) as reinforcement phase dispersed in matrix material.

LIN Y, ZHAMU A, JANG B Z

Integrated heat sink used in electronic device e.g. battery, camera unit comprises unitary graphene material article composed of heat collection member and heat dissipation member integral to the heat collection member.

ZHAMU A, WANG M, XIONG W, JANG B Z, YIJUN L

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K

Thermal management device e.g. heater or heater component comprises a composition comprising graphene sheets.

BROOKS L, SCHEFFER D

System for cooling, has micro channel comprising base with aluminum sheet metal, anodized aluminum, Teflon-coated aluminum, copper sheet metal, graphene and pyrolytic graphite, and side with copper foil, graphene and pyrolytic graphite.

DAVIS S

Thermal management assembly for transferring heat away from heat source, comprises first substrate, second substrate, bulk graphene material disposed between first and second substrates, and thermal bond layer.

FAN W, LIU X, MARINER J, RAPE A

Nuclear boiling heat transfer system, has base graphene multi-layered structure layer whose upper part is formed with multiple bubbles by supplying nuclear boiling heat to surface of base graphene multi-layered structure layer.

KIM M H, AHN H S, KIM J

Heat sink material for use in e.g. portable, and electronic devices comprises mixed starting material comprising graphene, graphite fiber and adhesive.

HE Q