国家/地区 日本（151）
IPC部 B（151）
IPC大类 B32（151）
IPC小类 B32B（151）
IPC C01B031/02（74） B32B009/00（72） C01B031/04（41）
B82Y030/00（40） B82Y040/00（35） H01B013/00（31）
H01B005/14（29） H01B001/04（25） C23C016/26（20）
H01L021/02（16） B32B009/04（15） C01B032/194（15）
H01L029/16（15） C08K003/04（14） C01B032/182（13）
发明人 JIANG K（8） FAN S（7） KIMURA N（7）
SHIMIZU K（7） TATENO Y（6） CHOI J（5）
KOBAYASHI T（5） SUEMITSU M（5） FAN F Y（4）
FUKIDOME H（4） LEE S（4） MIHASHI F（4）
MITSUHASHI F（4） SATO M（4） ZHANG L（4）
公开年 2021（23） 2013（20） 2012（18） 2014（17） 2011（13） 2015（11） 2017（9） 2022（8） 2010（7） 2009（6） 2016（5） 2018（3） 2020（3） 2023（3） 2003（2）
申请年 2012（25）  2013（19）  2011（15）  2020（14）  2009（11）  2021（11）  2010（10）  2014（8）  2015（7）  2016（7）  2019（6）  2017（5）  2022（4）  2002（2）  2007（2）  2008（2）  2018（2） 
专利权人 HON HAI PREC.（8） HONGFUJIN PR.（8） SONY CORP（8） UNIV TSINGHU.（8）
SUMITOMO ELE.（7） MITSUBISHI M.（5） SAMSUNG ELEC.（5） UNIV TOHOKU（5）
FUJI ELECTRI.（4） SAMSUNG ELEC.（4） SEMICONDUCTO.（4） NAT INST ADV.（3）
TORAY IND IN.（3） TOSHIBA KK（3） UNIV SUNGKYU.（3） AKASAKA Y（2）
BASF SE（2） COMMISSARIAT.（2） EMPIRE TECHN.（2） GRAPHENE SQU.（2）

Crystalline carbon substrate material has surface that is flattened by forming single layer or multiple layers of metal film having thickness of 100 nm or more on substrate surface by vacuum film forming process and hot-pressing entire surface in vicinity of melting point of metal film.

HIRAI A

Electronic component package, comprises polymeric core comprising first polymeric material and an outer overmold layer comprising second polymeric material containing graphene, outer overmold layer defining a case skin disposed on polymeric core,where first and second polymeric are thermoplastic.

NARITA M, SARANG S, KHAN S

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D

Graphene laminate comprises substrate having insulating surface, intermediate layer located on and in contact with substrate, and graphene film located on intermediate layer and in contact with intermediate layer.

OKIGAWA Y, YAMADA T

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Radio wave absorber for absorbing radio waves used in mobile communication of e.g. mobile phone, has radio wave absorbing layer that contains resin binder, magnetic iron oxide powder, and carbon-based fine particles which magnetically resonate in preset frequency band.

TOSHIO H, ATSUSHI H, RYOHEI F

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Radio wave interference type radio wave absorber for absorbing undesired radio waves used in e.g. mobile phones, is formed by successively stacking resistor film, dielectric layer, and radio wave shielding layer, and protection layer which is provided above resistor film.

MASAYUKI T, MASAO F

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Producing graphene by forming buffer layer made of silicon oxycarbide and single layer of graphene formed on buffer layer on surface of silicon carbide substrate by heating silicon carbide substrate in atmosphere of acetylene gas and oxygen gas, and peeling single layer of graphene.

TANIYASU Y, SASAKI K, TANAKA S, KAJIWARA T