国家/地区 中国（13）
IPC部 C（13）
IPC大类 C08（13）
IPC小类 C08K（13）
IPC C08K009/04（13）
发明人 CHEN Y（3） LI Y（2） LIN Y（2）
LIU Y（2） LIU Z（2） WANG S（2）
ZHANG H（2）
公开年 2017（11） 2016（2）
申请年 2016（13）
专利权人 UNIV GUANGDO.（2）

High thermal conductivity type epoxy resin composite material for LED bonding layer, contains bisphenol A type epoxy resin, boron carbide powder, aluminum oxide, glue 107, dibutyltin dilaurate, ethyl orthosilicate, graphene oxide.

LI H, LIU Y, CHEN Y

Modified graphene-containing thermally conductive masterbatch comprises graphene, modifier and nylon 6.

CUI S, DING P, LI D, LIU J, PAN G, SHI L, SONG N, ZHANG Y

High thermal conductivity composite material comprises e.g. silicon carbide, aluminum powder, silicon dioxide, aluminum nitride, polyvinyl butyral, stearic acid, silver particles, dimethyl silicone oil, graphene and lithium hydroxide.

GUO H, AN D, XIA J, XIAO J, LAI C

Preparing graphene-based thermally conductive interface material comprises mixing graphene material, vinyl silicone rubber, hexagonal boron nitride, vinyl silicone oil and first silane coupling agent, compressing, rolling and cutting.

DING S, ZHOU X, LIU Z

Resin-based graphene thermal conductive composite material used for charging pile, contains ethylenediamine, oxidized graphene quantum dots, 4-dimethylaminopyridine, anionic surfactant, deionized water and polymer resin.

JIAO W, YE E, HUANG Y, LIANG K

Car door sealing ring comprises e.g. polybutadiene, ethylene propylene diene monomer rubber, nitrile butadiene rubber, graphene, modified calcium oxide, cyclopentanecarboxylic acid, n-cyclohexylbenzothiazole-2-sulfhenamide and zinc oxide.

XUAN Q

Crack-resistant sealing rubber material contains magnesium sulfate, barium borate, alkyl ketene dimer, butyl methacrylate, graphene oxide, sodium borohydride, hydrochloric acid, sodium nitrite, potassium persulfate and butadiene rubber.

ZENG Q

Preparation of high-thermal-conductivity composite plastic filled with three-dimensional graphene, for use in heat exchangers, involves mixing graphene surface-modified with surfactant, and molten plastic substrate, and pressing.

LI Y, ZHANG H, LIN Y, WANG S, CHEN Y

Preparing high-molecular matrix/three-dimensional graphite composite material used in integrated circuit, involves dispersing graphene in de-ionized water, adding surfactant, heating mixture and mixing with polymeric substrate.

LI Y, ZHANG H, LIN Y, WANG S, CHEN Y

Engine oil sealing fluororubber comprises e.g. a modified graphene, and which is a composite nanoparticle formed by calcining graphite after the surface modification of polyacrylamide and coprecipitation by hydrothermal co-precipitation.

LIU Z, HU Y, ZHANG W