国家/地区 中国（12） 韩国（3） 欧洲专利局（EPO）（2） 日本（2） 台湾（2） 美国（2） 世界知识产权组织（2）
IPC部 C（17） H（3）
IPC大类 C08（17）
IPC小类 C08G（17）
IPC C08L063/00（17）
发明人 LIU Y（3） LI G（2） WANG Z（2）
ZHANG X（2）
公开年 2022（10） 2021（6）
申请年 2021（17）
专利权人

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Manufacturing heat dissipation sheet e.g. for light-emitting diode lighting lamp comprises e.g. mixing heat dissipation sheet main raw material of conductor powder and additives in bind composed of liquid nitrile rubber-modified epoxy resin.

BAEK L J

Composite material used for fabricating load-bearing structures, comprises reinforcement fibers impregnated with thermoset resin composition comprising epoxy resin component, curative component comprising 4,4'-methylenebis(2,6-xylidine), and thermoplastic component.

RESTUCCIA C L

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Semi-rigid epoxy resin foam material useful in fields of aerospace, military and national defense, automobile industry, biology, electronics and medicine, comprises flexible segment-containing linear epoxy resin.

LIU Y, ZHANG Z, LI X

Epoxy resin composition useful for carbon fiber winding, comprise hydantoin epoxy resin, terpyridine-based epoxy resin, interface binder, reactive diluent, hydrophobic modified nano-filler, latent curing agent, accelerator, and wetting and dispersing agent.

QIU S, DENG H, ZHENG S, HUANG B, LI G, LIN W

Preparing continuous fiber-reinforced thermosetting resin-based composite material having high thermal conductivity, comprises e.g. dispersing epoxy prepolymer, curing agent, catalyst, thermally conductive filler and solvent, impregnating continuous fibers, then hot-pressing.

ZHAO J, LIU S, WANG Z, YUAN Y

Preparation of high heat conducting conductive and flame retardant graphene/epoxy resin composite material by heating low eutectic solvent and antimony trioxide, adding graphene, intermittent ultrasonically treating and adding epoxy resin.

WANG J, TANG Y, HONG M

Graphene/liquid crystal epoxy resin high thermal conductivity composite material comprises liquid crystal epoxy resin, liquid crystal functionalized magnetic graphene and curing agent.

WANG Z, ZHANG X, ZHAO Q, ZHANG T, CHEN F