国家/地区 韩国（33）
IPC部 C（33） B（13） H（8）
G（2）
IPC大类 C08（33）
IPC小类 C08L（33） C08K（28） C08J（13）
C08G（10） C01B（8） C09D（7）
C09K（6） H05K（6） H01B（5）
B29C（4） B82Y（4） H01L（4）
B32B（3） B82B（3） C09J（3）
IPC C08L063/00（33）
发明人 LEE K（3） SONG J（3） CHI S（2）
CHOI S（2） JI S Y（2） KIM J H（2）
KIM N H（2） KIM S（2） KIM S H（2）
LEE E J（2） LEE J H（2） LEE K D（2）
NAM C R（2） PARK S（2） PARK S H（2）
公开年 2021（6） 2022（6） 2013（4） 2014（4） 2023（4） 2015（3） 2012（2） 2018（2）
申请年 2021（8）  2012（4）  2020（4）  2011（3）  2013（3）  2022（3）  2014（2）  2015（2） 
专利权人 SAMSUNG ELEC.（4） HANSOL CHEM .（2） KOREA INST S.（2） UNIV CHONBUK.（2）
UNIV INHA RE.（2） UNIV ULSAN F.（2）

Flexible polymer heat dissipation sheet comprises matrix resin containing nitrile-butadiene rubber, acrylic resin, epoxy resin, phenoxy resin, urethane resin, and/or silicone resin, graphene particles and dispersing agent.

YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Carbon composite material useful for building materials for heating and and electronic industry and electronic devices, comprises polymer resin and carbon material.

YANG C M, KIM J H, LEE Y S, RYEOL K N, KIM S K, RYU J S, LEE M W, NA W, MINGOOK K, PARK H B

Producing film-type carbon material, comprises e.g. mixing epoxy resin and grapheme, preparing carbon material precursor having continuous skeleton, and heat-treating to carbonize film-type carbon material precursor.

KIM J P, KIM K S, CHOI D Y

Manufacturing heat dissipation sheet e.g. for light-emitting diode lighting lamp comprises e.g. mixing heat dissipation sheet main raw material of conductor powder and additives in bind composed of liquid nitrile rubber-modified epoxy resin.

BAEK L J

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Epoxy composite material comprises epoxy resin, oxides having oxygen functional group and containing carbon and basalt fiber.

PARK S, HWANG K S