国家/地区 中国（34）
IPC部 C（35） B（10） H（5）
IPC大类 C08（35）
IPC小类 C08L（35） C08J（27） C08K（21）
C09D（8） C08G（7） B32B（6）
H05K（4） C01B（2） C09J（2）
IPC C08L079/08（35）
发明人 JIANG X（3） ZHANG S（3） ZHANG Y（3）
CHEN K（2） FENG L（2） LAI Z（2）
LI H（2） LI L（2） LI N（2）
LIANG X（2） LIAO X（2） LIU G（2）
LIU J（2） LIU Z（2） LUO X（2）
公开年 2022（35）
申请年 2021（35）
专利权人 ENANO SHENZH.（2） GUANGDONG SU.（2） ITEQ WUXI EL.（2） SUZHOU AILEG.（2）

Preparing aerogel composite heat-insulating sheet involves mixing aerogel powder with ethanol, dispersing, adding aqueous polytetrafluoroethylene emulsion, fully stirring to obtain floccule, then milling on open mill to obtain aerogel/polytetrafluoroethylene composite material.

HOU Y

Polymer composition used in semi-conductors, consumer electronics and industrial constructions, comprises polyetherimide resin, crystalline polyester resin, inherently dissipative polymer, and transesterification inhibitor.

JIANG X, ZHENG Y, CHENG Y

Conductive high temperature resistant polyimide composite material comprises surface of conductive fabric prefabricated body, whose surface loaded with nano conductive flocking body and conductive polyimide resin system comprises conductive fillers.

ZHANG H, LI L, WANG G, XIN Y, XU X, YIN X, WANG D, KE H, LI N

Use of conductive ink in reducing the resistivity of a flexible electrode plate after multiple bending, by coating conductive ink on the flexible polar plate under the deformation state, sintering, and spraying solvent, and coating the flexible plate.

YUAN H, YE Y, GUO X, XU X, SUN S, CHEN M, LI W

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

High wearable and toughened polybutylene terephthalate material for automobile inhaul cable, comprises polybutylene terephthalate, wearable agent, toughening agent, compatibilizer, antioxidant, lubricant, graphene composite modified polyimide fiber and ionic liquid composite rare earth liquid.

WANG S, ZHANG T, WANG M, WANG K, WANG J

Conductive and heat-conducting polyimide film comprises heat conducting coating, conductive layer, adhesive layer, layer base material, and protective film.

XU W

High heat-conducting polyimide film with good film-forming properties comprises aromatic diamine monomer, aromatic dianhydride monomers, heat-conducting filler, film-forming auxiliary materials and polar solvents.

LI X, LAI Z, FENG L, LIANG X, LIU Z, ZHU X

Polyimide composition for additive manufacturing, comprises raw material components such as crystalline polyimide resin, nano-carbon material,polycarbonate, nano-whisker, heat stabilizers.

WANG F, ZHOU L, LUO X, MENG S