国家/地区 中国（42） 美国（5） 日本（3） 韩国（3） 世界知识产权组织（3）
IPC部 C（43）
IPC大类 C08（43）
IPC小类 C08L（43）
IPC C08L079/08（43）
发明人 WANG D（4） ZHOU H（4） CHEN C（3）
DING P（3） GUO Y（3） SHI L（3）
SONG N（3） YANG L（3） ZHAO J（3）
ZHAO X（3） CHEN Y（2） DING Q（2）
FENG W（2） FENG Y（2） KIM S H（2）
公开年 2020（12） 2021（12） 2017（4） 2018（4） 2023（4） 2013（2） 2022（2）
申请年 2021（9）  2019（8）  2020（8）  2017（4）  2016（3）  2018（3）  2022（2）  2023（2） 
专利权人 UNIV JILIN（3） UNIV SHANGHA.（3） UNIV NANJING.（2） UNIV TIANJIN（2）

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing ultra-high elastic polyimide fiber/graphene composite gas gel comprises e.g. dispersing polyimide chopped fiber in alkali solution, performing surface modification, mixing graphene solution dispersion liquid with polyimide chopped fiber, dialyzing, freezing and drying.

FENG Y, YIN W, FENG W

Preparing polyimide composite material with double thermally conductive network comprises e.g. mixing polyamic acid powder, water, triethylamine and first thermally conductive filler, freeze-drying, performing thermal imidization, vacuum-impregnating and hot-pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

High heat-conducting polyimide film with good film-forming properties comprises aromatic diamine monomer, aromatic dianhydride monomers, heat-conducting filler, film-forming auxiliary materials and polar solvents.

LI X, LAI Z, FENG L, LIANG X, LIU Z, ZHU X

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Preparation of low dielectric constant liquid crystal polymer (LCP) film, involves acetylating hydroxyl-containing aromatic monomer, polymerizing acetylated monomer, performing transesterification reaction, ball milling and mixing liquid crystal polymer and filler, melting and plasticizing mixture.

XU L, YU R, ZHANG D

Method for preparation of hybrid membrane used for solar sea water desalination, involves adding high molecular polymer into solvent under high temperature stirring condition, combining material with high thermal conductivity and high photo-thermal conversion capability forming composite material.

HE L, LIU R, GE C, GUAN H, ZHANG X, MA C

Preparing polyimide/graphene composite thermally conductive film, involves performing polycondensation of dianhydride, crosslinking polyamic acid and polyvinyl alcohol followed by subjecting film-forming mixture to thermal imidization.

XU Z, LIU G, ZHANG Q