国家/地区 美国（27）
IPC部 C（27）
IPC大类 C08（27）
IPC小类 C08L（27） C08K（24） C08J（15）
C08G（11） C01B（9） B82Y（6）
C09D（6） B32B（5） C09K（5）
H01B（5） H05K（4） B29C（3）
C04B（3） H01L（3） B05D（2）
IPC C08L079/08（27）
发明人 KIM S H（3） SHAFAEI S（3） SHETH K C（3）
CHOI J Y（2） CUI Z（2） DE LUNA R M（2）
HAM S J（2） IGUCHI H（2） JI S Y（2）
JIN J（2） KASHIWAGI T（2） KIM K S（2）
MAPKAR J A（2） TSUTSUMI Y（2） WON D Y（2）
公开年 2021（6） 2020（4） 2022（3） 2011（2） 2012（2） 2013（2） 2014（2） 2017（2）
申请年 2019（5）  2011（4）  2020（3）  2013（2）  2014（2）  2018（2）  2021（2）  2022（2） 
专利权人 SABIC GLOBAL.（3） EATON INTELL.（2） SAMSUNG ELEC.（2） SHINETSU CHE.（2）

Powder composition for three-dimensional body, comprises predefined amount of polyimide particles having specific average particle size, formed by polymerizing diamine monomer(s) and dianhydride monomers, where polyimide particles material has specific crystallinity and glass transition temperature.

KEMPINSKI K, KERSZULIS J, CHASTAIN J C, DUIS P G, KEMPINSKI K A

Producing maleimide resin film used in flexible printed-wiring boards, involves applying maleimide composition in fluid form to form shape of film, and volatilizing organic solvent from the maleimide composition to obtain the maleimide resin film which is solid and uncured resin film.

KASHIWAGI T, TSUTSUMI Y, IGUCHI H

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Forming electrically conductive deposition material extrudable in fluid state for deposition via additive manufacturing system and forming three-dimensional object, involves pre-mixing polymer component and extrudability component.

DE LUNA R M, MAPKAR J A

Electrically conductive deposition material extrudable in fluid state for deposition via additive manufacturing system, comprises polymer component, filler component comprising strengthening component and extrudability component.

MAPKAR J A, DE LUNA R M

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Graphite sheet useful for electronic device, has thermal conductivity in plane direction, and thermal conductivity in thickness direction.

KIM K S, WON D Y, CHOI J Y, CUI Z, YUAN D, JIN J

New modified graphene used for forming modified graphene-resin composite and modified graphene dispersion, has preset ratio of intensity of G band with respect to intensity of D band in Raman spectroscopy spectrum.

WATANABE T, KITAO A, SUZUKI K, KOBAYASHI Y, WATANABE D, KOBAYASHI A