国家/地区 中国（4） 韩国（4） 美国（4） 世界知识产权组织（4）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08K（8）
IPC C08K003/04（7） C09K005/14（6） H05K007/20（3）
C08K007/06（2） C08K009/02（2） C08L101/00（2）
发明人
公开年 2021（8）
申请年 2020（4）  2019（3） 
专利权人

Preparing radiating eye-protecting table lamp comprises e.g. preparing base, support, lampshade shell and lampshade cover plate, assembling base, support, lampshade shell, lampshade cover plate and LED lamp assembly, and forming base, support and lampshade shell by injection molding.

WANG K, TANG J, YAO L

Cooling structure used for cooling article, comprises infrared ray and UV ray absorption and emission layer comprising polymer matrix and conversion material comprising nanoparticles of core-shell structure including core formed of semiconductor material and shell, and visible light reflective layer.

OH S J, LEEHEON, JEON S, SONSUMIN

Modified polypropylene-based tower filler used for cooling water, comprises polypropylene, ethylene-propylene copolymer, polypropylene grafted maleic anhydride, initiator, modifier, antioxidant, carbon material, fiber, and filler.

RIDLEY R N, LI D

High heat-conducting graphene floor heating pipe comprises pipe body, polyethylene layer, steel wire net layer, and graphene heat-conducting layer including graphite, antioxidant, dispersant, coupling agent, heat stabilizer, and plasticizer.

XU W, LIU Y, ZHANG H

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

Dynamic shaft seal used for tribological system, comprises elastomeric material, and graphene containing elemental carbon, as sole component of dynamic shaft seal.

MENZEL J, TRABER B, ADLER M, FLEISCHMANN E, PORTELA C C, PORTELA CUBILLO C

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y