国家/地区 中国（9）
IPC部 C（11）
IPC大类 C08（11）
IPC小类 C08G（11）
IPC C08K003/36（11）
发明人 DENG H（2） HUANG B（2） LI G（2）
LIN W（2） QIU S（2） ZHENG S（2）
公开年 2022（11）
申请年 2021（5）  2022（4）  2020（2） 
专利权人 GUANGDONG JO.（2）

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

Preparing graphene and natural silk reinforced epoxy composite materials by providing mixed solution for graphene oxide solution, epoxy resin and relevant hardener, producing homogeneous graphene oxide/epoxy resin, impregnating with silk fabric to reach final product, and synthesizing final product.

SHARMA S, SANJEEV K, SHARMA P B, ISMAIL A H

Polyvinyl chloride pipe useful for e.g. water supply of tap water, comprises polyvinyl chloride resin, talc powder, calcium-zinc stabilizer, silicon dioxide, lubricant, titanium dioxide, ethylene-methyl methacrylate copolymer, solid plasticizer, aging-resistant filler and impact modifier.

XU R, WANG Y

Thermoplastic polyurethane elastomer useful for charging pile sheath comprises isocyanate, polyol compounds, nano-filler, protective agent and compatibilizer.

XU Z, ZHANG X, LONG S, CAI J

Producing maleimide resin film used in flexible printed-wiring boards, involves applying maleimide composition in fluid form to form shape of film, and volatilizing organic solvent from the maleimide composition to obtain the maleimide resin film which is solid and uncured resin film.

KASHIWAGI T, TSUTSUMI Y, IGUCHI H

Manufacture of high heat-resistant ultra-low expansion polyimide film for e.g. electronics, microelectronics , optical display or optical communication field, by mixing raw material with solvent, filtering, vacuum defoaming, uniformly coating, and peeling substrate.

QIAN X, LIAO B, ZHANG B

Modified epoxy resin useful as electric material, electronic material, matrix and coating for building material,.

LV S, LU Z, WU J, LIN J

Graphene-polyimide (PI) film useful in electronic field comprises 4,4'-Oxydiphthalic anhydride, 4,4'-diaminodiphenyl ether, modifier, filler and binder.

SHI L, ZHU Q, ZHENG Z

Epoxy resin composition useful for carbon fiber winding, comprise hydantoin epoxy resin, terpyridine-based epoxy resin, interface binder, reactive diluent, hydrophobic modified nano-filler, latent curing agent, accelerator, and wetting and dispersing agent.

QIU S, DENG H, ZHENG S, HUANG B, LI G, LIN W