国家/地区 中国（50） 美国（4） 韩国（2） 台湾（2） 世界知识产权组织（2）
IPC部 C（55） B（6）
IPC大类 C08（55）
IPC小类 C08G（55）
IPC C08K003/38（55）
发明人 WEN Y（9） WANG L（6） CHENG X（5）
LIU S（5） WANG X（5） YUAN Y（4）
ZHAO J（4） LIU J（3） CHEN H（2）
CHEN Q（2） GAO Y（2） IGUCHI H（2）
KASHIWAGI T（2） LI H（2） LI X（2）
公开年 2018（14） 2021（13） 2022（12） 2015（3） 2016（3） 2017（3） 2020（3） 2023（3）
申请年 2016（15）  2022（14）  2020（11）  2017（5）  2021（5）  2015（2） 
专利权人 HENAN HAINAD.（9） UNIV SOUTH C.（4） HEZHOU BAOXI.（2） SHINETSU CHE.（2）

Preparing continuous fiber reinforced aromatic polyimide 3D printing thermal conductive composite material comprises e.g. impregnating continuous fiber filaments or tapes in aromatic polyimide prepolymer/thermal conductive filler, adjusting glue content and ribbon shape, curing resin.

LIU S, ZHAO J, LI L, YUAN Y

Preparing polyimide film comprises e.g. mixing film polyimides, thermally conductive fillers and solvents, uniformly dispersing to obtain mixed dispersion, and coating the dispersion on substrate, and synthesizing by polymerization.

NIU S, SUN X

Continuous fiber reinforced polyhexahydrotriazine three-dimensional printing thermal conductive composite material useful in the technical field of three-dimensional printing of composite materials.

LIU S, ZHAO J, CHEN H, YUAN Y

Preparing boron-doped fluorinated polyimide film used in supercapacitor, involves obtaining polyimide by weighing certain amount of diamine, and four organic solvent and adding into mouth flask, stirring at normal temperature to diamine to dissolve, and weighing certain mass of dianhydride.

LI X

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

One-component thermal-gel composition used for heat dissipating material for dissipating heat from substrate, comprises crosslinkable organopolysiloxane, hydrolyzable organopolysiloxane, thermal conductivity enhancing agent, organopolysiloxane, adhesion promoter, antioxidant, and pigment.

DUTTA P, DASGUPTA D, MS A, FUJIMOTO T, CHISATO H, ANJITHA M, HOSHINO C

Peeling graphene useful in preparing graphene flexible film, comprises mixing graphite powder, bio-based graphene dispersant and deionized water evenly, and peeling off mechanically to obtain graphene dispersion.

LIU J, YANG J, WU Q, WU M, ZHU Y, ZHANG J

Producing maleimide resin film used in flexible printed-wiring boards, involves applying maleimide composition in fluid form to form shape of film, and volatilizing organic solvent from the maleimide composition to obtain the maleimide resin film which is solid and uncured resin film.

KASHIWAGI T, TSUTSUMI Y, IGUCHI H

Low-dielectric heat-conducting polyimide film comprises raw materials comprising dianhydride monomer, diamine monomer, solvent B, heat conducting filler, coupling agent, auxiliary agent and solvent A.

LAI Z, FENG L, TU Y, LIANG X, LIU Z, ZHU X