国家/地区 中国（84） 韩国（10） 美国（10） 日本（5） 台湾（4） 世界知识产权组织（4） 欧洲专利局（EPO）（2） 印度（2）
IPC部 C（98） H（12） B（10）
F（2） G（2）
IPC大类 C08（98）
IPC小类 C08G（98）
IPC C08L063/00（98）
发明人 LIU L（5） MIAO J（5） WANG S（5）
WANG Y（5） LI J（4） LI X（4）
LIU Y（4） ZHAO L（4） CHEN Y（3）
HUANG Y（3） LI G（3） LI Y（3）
LIU H（3） LIU J（3） LIU S（3）
公开年 2022（20） 2017（19） 2018（13） 2021（11） 2016（7） 2015（6） 2020（5） 2023（4） 2012（3） 2014（3） 2019（3） 2013（2）
申请年 2016（17）  2021（17）  2017（10）  2020（10）  2022（10）  2015（8）  2018（8）  2014（4）  2019（4）  2011（3）  2013（3）  2012（2） 
专利权人 WUXI CHANGAN.（5） SAMSUNG ELEC.（3） UNIV SHANGHA.（3） CHANGZHOU BA.（2）
HARBIN INST .（2） HUIZHOU ZHON.（2） LIN K（2） SUZHOU TAIHU.（2）
UNIV BEIJING.（2） UNIV CHINA G.（2） UNIV SICHUAN（2） UNIV YANTAI（2）

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Low dielectric composition useful in laminated plate of printed circuit board, comprises epoxy resin, hardener comprising flame retardant hardener and benzoxazine resin, halogen free flame retardant, accelerator, additive comprising inorganic filler, toughening agent and solvent.

YAO J, GONG J, CHEN S, TANG F

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Preparing nanoparticle-modified resin matrix based on direct ultrasonic dispersion method useful for resin or composite material forming, comprises e.g. adding curing agent to main resin, adding nanoparticles, immersing ultrasonic horn in resin mixture, and dispersing nanoparticles.

MA Z, FENG Z, YANG Y, LI L

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Popcorn healthcare sole material comprises diphenylmethane diisocyanate, toluene diisocyanate, polyester polyol, chain extender, antioxidant, graphene powder, epoxy resin, polyamine, acrylonitrile, ethylene oxide, carbon amide, thiourea and methylene dichloride.

WANG L

Self-healing and damage-in-situ recognition epoxy resin composite material useful for functional epoxy resin composite material, comprises epoxy resin matrix, curing agent, microcapsules loaded with epoxy resin repairing agent, and microcapsules loaded with thiol repairing agent.

BAI Y, HUANG Y, LIU L, LI J, WANG B, SHEN Y, YUAN W, HU Z

Preparing graphene and natural silk reinforced epoxy composite materials by providing mixed solution for graphene oxide solution, epoxy resin and relevant hardener, producing homogeneous graphene oxide/epoxy resin, impregnating with silk fabric to reach final product, and synthesizing final product.

SHARMA S, SANJEEV K, SHARMA P B, ISMAIL A H

Manufacturing heat dissipation sheet e.g. for light-emitting diode lighting lamp comprises e.g. mixing heat dissipation sheet main raw material of conductor powder and additives in bind composed of liquid nitrile rubber-modified epoxy resin.

BAEK L J