国家/地区 中国（22）
IPC部 C（22） B（4） H（2）
IPC大类 C08（22）
IPC小类 C08G（22）
IPC C08L063/02（22）
发明人 CHEN L（3） HUANG Y（2） LI G（2）
LI L（2） LI Q（2） LIU L（2）
LIU Y（2） YANG J（2）
公开年 2022（7） 2021（5） 2023（4）
申请年 2021（9）  2022（4）  2013（2）  2016（2）  2023（2） 
专利权人 HARBIN INST .（2） WUHAN INST T.（2）

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Epoxy resin composite material with low viscosity and high mechanical strength for preparing high performance epoxy system with low viscosity and high mechanical strength comprises epoxy resin, curing agent, multidimensional composite dispersion liquid and reinforcing agent.

CHENG J, CHEN Y, ZHANG J

Modifying carbon fiber supporting epoxy resin used as base material in chemical process device e.g. adding diethylenetriamine, 1-ethyl-carbodiimide hydrochloride and N-hydroxysuccinimide, mixing and stirring organic phase, and adding alkaline solution and reacting.

GUO Z, CHEN L, HE L, LIU D

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Preparation of shape memory epoxy foam composite material for shape memory plugging agent, involves mixing aqueous dispersion of nano particles with epoxy monomer, stirring to form Pickering emulsion and adding curing agent into pickering emulsion, pouring emulsion into mold, heating and curing.

QIN W, GU L, HE S, MA Q, ZHOU D, WU Y, FENG H, LIU L, XING X, LI Z

Modified epoxy resin useful as electric material, electronic material, matrix and coating for building material,.

LV S, LU Z, WU J, LIN J

Preparing toughening high heat-conducting filler based on thermosetting resin for improving toughness and heat conductivity of thermosetting resin, involves firstly dispersing functionalized carbon material in solvent A, then dropping isocyanate into obtained functionalized carbon material solution.

LIU K, ZHU X, WENG L, YU Y, XU H, ZHANG X

Preparing anti-lightning and anti-static epoxy resin comprises e.g. adding dimethyl hydantoin to reactor, stirring and cooling, stopping flowing nitrogen, adding functionalized graphene slurry, injecting into mold, placing it in vacuum box to exhaust, and cooling to normal temperature.

WEI S, ZHA X