国家/地区 韩国（11）
IPC部 C（11）
IPC大类 C08（11）
IPC小类 C08K（11）
IPC C08K005/00（11）
发明人 JUNG H S（2） KIM J S（2）
公开年 2021（3） 2022（3）
申请年 2021（3）  2020（2）  2022（2） 
专利权人 JUNG H S（2）

Perovskite composite films useful in energy harvesting device, comprises halide perovskite material dispersed in organic matrix composed of natural polymers.

KIM T H, KIM Y J, HUN L

Eco-friendly paint composition useful e.g. for protecting buildings, comprises e.g. main material containing acrylic resin, resin mixture includes polyorganosiloxane resin, and carbon material, rubber powder and pigment, and curing agent.

JUNG H S, KIM J S

Eco-friendly paint construction method for buildings, comprises e.g. removing foreign substances on surface of object-to-be-coated, mixing main material and curing agent, painting and drying paint on surface of object-to-be-coated.

JUNG H S, KIM J S

Multilayered flexible package useful in packaging systems for food, cosmetic, nutraceutical or pharmaceutical products, comprises polymeric coating comprising dispersion of antioxidant particles.

RIVA M, VACCA P, FIDECKA K, FIDECA C

Transparent color resin for manufacturing base film for adhesive film, comprises e.g. binder resin including polyurethane resin and polyacrylate resin, azo-based pigments or polycyclic pigments, antistatic additive, catalyst and solvent.

LEE S, JOOKYUNGJAE

Three-dimensional curvature structure comprises ink pattern printed on biaxial pre-stretched polymer sheet, and printing pattern portion containing facet on which ink pattern is printed or not, produced by deformation by differential contraction between printed and unprinted portion by stimulation.

WIE J J, KIM H R, LEE J, CHOI J, KYUNG W S

Producing polyurethane foam, comprises dispersing turbostratic graphene in a polymerization solution, and adding second component for polymerizing with the first component to chemically convert polymerization solution into polyurethane foam.

MANCEVSKI V, VLADIMIR M

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Graphene oxide barrier film used in gas-barrier barrier device and used in food packaging applications, comprises crosslinked composition comprising graphene, polymer, and crosslinking group.

ZHENG S, KATAYAMA H, SIMAVORYAN S

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S