国家/地区 中国（22） 世界知识产权组织（3）
IPC部 C（23） B（6） H（4）
IPC大类 C08（23）
IPC小类 C08K（23）
IPC C08L083/04（23）
发明人 LI Z（3） GE X（2） LI M（2）
ZHANG C（2） ZHANG L（2）
公开年 2021（23）
申请年 2020（12）  2021（8）  2019（3） 
专利权人 NINGBO INST .（3）

Preparing graphite alkenyl composite heat-conducting pad used as heat interface material applied to heat conducting and radiating field, involves processing graphene sheet with ordered layered structure into porous net-shaped structure.

HUANG K, WEI T

Heat dissipation composition used for forming coating agent, comprises base polymer containing silicone-based resin and filler containing at least two of expanded graphite, carbon nanotubes, graphene and metal nanoparticles.

HWANG I S, PARK Y S, HWANG I C, PARK K H, HWANGINSEONG, CHAN H, PARK K

Light-responsive liquid-gas phase change composite material useful for preparing light-responsive device, comprises dispersion medium and dispersed phase including low-boiling point liquid and multifunctional filler.

XU G, GAO Q, SUN A, GUO J, LONG F, ZHAO Z, FANG M, SHAO Y, CHENG Y

Flame-retardant phase change microcapsule for preparing self-adaptive temperature control flame-retardant silicone foam gasket for power battery, comprises wall material comprising graphene, carbon nanotubes or phosphorene modified by silane coupling agent, and core material such as paraffin.

HUANG H, MAO C, YIN C, GE X, DU W

Preparation of heat conducting gasket used for electronic products by mixing phase change material, heat conducting filler, matrix material and crosslinking agent, performing curing crosslinking reaction, and freezing preform.

CHU W, JIANG N, LI M, YU J

Thermally conductive gasket comprises thermally conductive filler, which is two-dimensional thermally conductive filler arranged along thickness direction of gasket..

GE X, LI F, LI Z, SHI Y, ZHOU B

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Thermally conductive silicone grease composition comprises carbon material, low melting point metal, base oil and other additives.

CHEN C, CHAI G, TAN D, FAN Z, WANG C, PAN C

Preparing thermally conductive composite material useful in radiating field of electronic device, comprises e.g. obtaining three-dimensional porous graphene by laser processing polybenzoxazine resin, casting polymer fluid, and curing.

ZHAO W, LIU X, YU W, JIANG Y

Silicone pad used for module, contains silicone oil containing reactive groups, and norbornene-modified hydrogen-containing silicone oil, crosslinking reaction regulator, coupling agent, heat stabilizer, liquid metal, and thermal powder.

YANG X, ZHENG Y, WU J