国家/地区 中国（68） 美国（7） 世界知识产权组织（6） 日本（3） 韩国（3） 欧洲专利局（EPO）（2） 台湾（2）
IPC部 C（74）
IPC大类 C08（74）
IPC小类 C08K（74）
IPC C08K007/06（74）
发明人 WANG H（5） DING P（4） WANG J（4）
GUO Y（3） LI J（3） LIN H（3）
LIU C（3） SHI L（3） WANG Y（3）
WANG Z（3） XU T（3） ZHANG B（3）
ZHANG J（3） ZHAO L（3） AN D（2）
公开年 2021（22） 2018（13） 2017（12） 2022（12） 2020（7） 2023（5） 2019（2）
申请年 2021（18）  2020（13）  2018（11）  2017（10）  2022（8）  2016（6）  2019（5）  2023（2） 
专利权人 UNIV SHANGHA.（4） DAINICHISEIK.（2） INST METAL R.（2） NINGBO INST .（2）
SHENZHEN HAN.（2） ZHEJIANG NHU.（2） ZHEJIANG XIN.（2）

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Thermally conductive material comprises base polymer, ethylene methyl acetate, graphite fibers and bis(2-ethylhexyl) adipate.

PARE R, KAMAVARAM V

Carbon material dispersion liquid used for forming coating material, comprises carbon black, carbon fiber, graphite, graphene, water, and polymer dispersant comprising polymer block with structural units derived from acrylonitrile and methacrylic acid.

SHIMANAKA H, MURAKAMI K, DOI S, SHIMOOKA R, UMEDA D, KANEKO S, GOTO J

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Preparation of composite heat-conducting pad involves cutting planar high-thermal conductivity film material into fibers, filling gaps between high-thermal conductivity fibers with organic matter, and slicing obtained composite block in direction perpendicular to high-thermal conductivity fibers.

HUANG K, QIN F, WEI T

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

PTFE-based composite material used as high-speed sealing material, comprises PTFE, inorganic lubricating filler which is a two-dimensional material and fibrous filler fiber.

ZHANG H, WANG T, XIE H, LI S

Heat-conducting silicone gel composite material useful in the technical field of heat-conducting materials, comprises e.g. vinyl silicone oil, carbon fibers, chain extender, leveling agent, thixotropic agent and catalyst.

CHEN R, TU J, HUANG G, GUO Z, XU F

Preparing graphene fiber comprises forming multiple graphene fibers in graphene thermal conductive film slotting.

ZHANG P, ZHOU S, YANG S, HU J, GE X