国家/地区 世界知识产权组织（84）
IPC部 C（84） B（35） H（29）
F（8） G（8） E（5）
D（4） A（2）
IPC大类 C08（84）
IPC小类 C09K（84）
IPC C08K003/04（61） C09K005/14（29） C08K003/22（15）
C01B031/02（13） B82Y030/00（12） C01B031/04（12）
C08J003/20（12） B82Y040/00（11） C08J005/18（11）
C08L101/00（11） H05K007/20（11） C01B032/194（10）
C08K003/38（10） C01B032/182（8） C08K009/02（8）
发明人 ALSHARAEH E（7） ALMOHSIN A（4） KRISHNAN M R（3）
LI W（3） BATAWEEL M A（2） BERHANE A（2）
CHEN L（2） DING J（2） GUO F（2）
JANG B Z（2） KIM J（2） KYRLIDIS A（2）
LEE E J（2） LEE K（2） LEE K D（2）
公开年 2021（25） 2022（18） 2018（7） 2016（6） 2017（6） 2023（5） 2015（4） 2011（3） 2013（3） 2019（3） 2014（2）
申请年 2021（17）  2020（16）  2022（11）  2017（9）  2015（7）  2019（5）  2014（4）  2016（4）  2018（4）  2010（2）  2013（2） 
专利权人 ARAMCO SERVI.（8） SAUDI ARABIA.（8） UNIV ALFAISA.（6） FUJI POLYMER.（3）
NINGBO INST .（3） E INK CALIFO.（2） EINK CORP（2） HANSOL CHEM .（2）
HUAWEI TECHN.（2） L P PROPERT.（2） NANOTEK INST.（2） NISSAN MOTOR.（2）
SEKISUI CHEM.（2） SHENZHEN INS.（2） TUNGHSU OPTO.（2） TUNGHSU TECH.（2）
UNIV ADELAID.（2） UNIV RICE WI.（2） UNIV RICE WI.（2）

Syntactic foam comprises matrix material and multiple microspheres embedded within matrix material, where multiple microspheres comprises metallic glass material.

SINGH A, SHUKLA S

Member used for self-cooling in bed for active magnetocaloric regenerator, comprises heat dissipation sheath, self-cooling material loaded inside heat dissipation sheath and spacer provided on surface of self-cooling tape.

CHAE J G, WOO K, KANG K H, LEE A, CHUNG K C, KIM J W, LEE A Y

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Thermally conductive film for heat dissipation structure, is formed by arranging binder and scale-like carbon materials formed by graphene layers, and making portion(s) of minor axis of binder and minor axes of spaces formed by carbon materials and binder smaller than minor axis of carbon materials.

NAITO T, TSUKADA Y, KENEKO T, YAJIMA A, SHIRATORI K

Heat conductive film used for head-up display, is configured by disposing scale-like carbon material formed by graphene layers such that adjacent scale-like carbon materials contact each other, and such that major axis of scale-like carbon material is oriented in surface direction of film.

KANEKO T, NAITO T, TSUKADA Y, YAJIMA A, SHIRATORI K

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Dispersant used in composition for forming conductive material slurry, comprises copolymer comprising an acrylate structural unit, vinyl-based structural unit, and acrylamide structural unit.

AKITO I, YUTARO K, KYOICHI S, IBI A, KINOSHITA Y, SHIROTA K

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A