国家/地区 世界知识产权组织（15）
IPC部 C（15） H（15） B（5）
F（3）
IPC大类 C08（15）
IPC小类 H05K（15）
IPC C08K003/04（11） H05K007/20（8） H05K009/00（6）
C08J005/18（5） C09K005/14（5） C08K003/34（4）
C08K003/013（3） C08K007/06（3） C08L063/00（3）
C08L083/04（3） C08L101/00（3） H01L023/373（3）
H05K001/03（3） C01B032/19（2） C01B032/198（2）
发明人 CHO H（2） CHO H B（2） CHOA Y（2）
CHOA Y H（2） JANG B Z（2） JEAN B（2）
JIN R（2） KIM Y S（2） LIM M S（2）
LIMMINSUP（2） LIN Y（2） SONG Y（2）
SONG Y S（2） SUN R（2） ZHANG B（2）
公开年 2021（15）
申请年 2020（8）  2021（4）  2019（3） 
专利权人 GLOBAL GRAPH.（2） NANOTEK INST.（2） TICONA LLC（2） UNIV HANYANG.（2）

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Composite film used for electronic product, comprises polymer matrix layer in which magnetic fillers are dispersed, and metal mesh impregnated in polymer matrix layer.

CHOA Y H, KIM J R, SONG Y S, CHO H B, LEE S B, JUNG B M, KIM M Y, LIM M S, CHOA Y, SONG Y, CHO H, LIMMINSUP

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K

Composition used for forming article, comprises soft elastomer, conductive nanostructure and metal ferrite doped reduced graphene oxide.

RAJALAKSHMAN PAI A, THOMAS S, KALARIKKAL N, PAI A R

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Preparing thermally conductive gasket, by performing plasma modification on filler, grafting hydrolyzed coupling agent, hydroxylating, coating surface of modified graphite film with two-component polyolefin, pre-curing and hot-pressing.

YE Z, LI J, ZENG X, ZHANG C, ZHANG Y, SUN R

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B