国家/地区 中国（20） 世界知识产权组织（5）
IPC部 C（25） H（25） B（4）
IPC大类 C08（25）
IPC小类 C08K（25）
IPC C08K003/04（20） H05K009/00（13） C08L063/00（7）
H05K007/20（6） C08J005/18（5） C08K003/08（5）
C08K003/22（5） C08L023/12（5） C08K003/36（4）
C08K007/06（4） C09K005/14（4） C08K007/14（3）
C08K009/02（3） C08K009/06（3） C08L025/06（3）
发明人 CHEN C（2） HE J（2） LIU S（2）
LIU Y（2） ZHANG J（2） ZHANG W（2）
公开年 2023（25）
申请年 2022（25）
专利权人 CHANGSHU SHE.（2） SHENGYI TECH.（2）

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Two-part coating composition used to apply protective coating to surface of substrate, comprises part A having polyol, foam catalyst, gel catalyst, flame retardant, and water, and part B having e.g. isocyanate functional material.

ALLEN C, KINNER P, TURNER B G

Electromagnetic interference suppressing material used as radio wave absorber, noise suppression sheet, semiconductor sealing material, sealing sheet, and wire coating material, comprises base material containing organic substances and inorganic substances, and powdered carbon material.

NISHIHARA H, YOSHIDA S, UCHIDA K

Heat dissipation film has two-dimensional heat conduction elements assembled in orientation, and is prepared by dispersing two-dimensional heat conduction elements and gel components in water, placing planar substrate that can release charged particles in assembly liquid, and assembling element.

GAO W, ZHAO N, WU Y, BAI H

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Resin composition useful in preparing low-flow adhesive prepreg comprises epoxy resin, epoxy curing agent, curing accelerator, carboxylated nitrile rubber, carbodiimide compound.

ZHANG W, CHEN C, HE J

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Foamed wave-absorbing material comprises polypropylene, wave absorbing agent, metal micro-nano particles, flame retardant, compatibilizer, stabilizer, antioxidant and lubricant.

LI H, NIE J

Low-temperature-resistant and high-modulus electromagnetic shielding material useful in field of functional polymer materials, comprises e.g. polycarbonate e.g. bisphenol A polycarbonate resin, toughening agent e.g. silicone core-shell polymer, and carbon-based conductive filler e.g. graphene.

WU T, LI Y