国家/地区 欧洲专利局（EPO）（30）
IPC部 C（30） B（16） H（15）
D（4） F（4） G（3）
IPC大类 C08（30）
IPC小类 C09K（30）
IPC C08K003/04（18） C01B031/02（11） C01B031/04（10）
C09K005/14（9） C01B032/194（8） C01B032/182（7）
C08L101/00（7） B82Y030/00（6） B82Y040/00（6）
C08J003/20（6） C08K003/013（5） C09K003/00（5）
C01B032/20（4） C08K003/22（4） C09D005/24（4）
发明人 KIM D（2） KIM D Y（2） KIM J（2）
LOSIC D（2） NINE M J（2） TOUR J（2）
TOUR J M（2） TRAN D N H（2）
公开年 2021（9） 2015（4） 2016（4） 2018（4） 2022（3） 2011（2）
申请年 2021（6）  2015（5）  2017（5）  2020（5）  2010（2）  2013（2）  2014（2） 
专利权人 FUJI POLYMER.（2） NINGBO INST .（2） UNIV ADELAID.（2） UNIV RICE WI.（2）
UNIV RICE WI.（2）

Carbon material dispersion liquid used for manufacturing e.g. paints, comprises carbon material containing carbon black, organic solvent, and polymer dispersant comprising amine-containing structural unit, propanone-containing structural unit, and other structural units connected to these units.

HIROYUKI S, YOSHIKAZU M, JUN K, SEIJI D, SHIMANAKA H, MURAKAMI Y, KAMABAYASHI J, DOI S

Composite for article of manufacture such as medical cushioning foam, mattress, mattress topper pad, pillows, bedding product and pet beds, comprises flexible cellular foam and highly thermally-conductive nanomaterials dispersed in foam.

GRAMLICH T, STOJANOVIC H

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Flowable hardenable composition used in electronic heat sink assembly, comprises shaped composite particles, having thermal filler particles having specific aspect ratio retained in binder matrix, dispersed in hardenable binder precursor.

PEREZ M A, MARTINEZ J A

Composition for coating and for forming a coating on substrate e.g., surface of boat or ship comprises epoxy-functional monomers, diluent, and sufficient amount of hydrophobicity-modifying additive that is reactive in epoxide polymerization.

GAIER M, ALGERMOZI M, RODIONOV I

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Hollow particles used for heat-dissipation fluid composition, comprise inorganic particle layer comprising ceramic particles and conductive carbon-based particles as spherical hollow particles and having empty inner space inside, and polymer coating layer.

KWON K A, CHUN M S, KIM D Y, SEOK C M, KIM D, QUAN W, QUAN J

Filament material for marking three-dimensional (3D) printed object, has polymer resin (compatible with extrusion based printing process), and marking additive that allows portions of filament material to change color when exposed to light.

HU N X, HU N

Carbon abrasive used to polish slurry, and manufacture semiconductor device contains carbon nanoparticle, and positively charged polymer, and/or positively charged oligomer disposed on surface of carbon nanoparticle.

TAKAI K, KIM D Y, KIM D