国家/地区 日本（44）
IPC部 C（44） B（16） H（11）
D（3） G（3） A（2）
F（2）
IPC大类 C08（44）
IPC小类 C08K（44）
IPC C08K003/04（32） C08K003/013（8） C08L101/00（8）
C01B032/194（7） C08K003/34（7） C08K003/08（6）
C08K003/22（6） C09D007/61（6） C01B032/198（5）
C08J005/18（5） C08K003/36（5） C09D201/00（5）
B82Y030/00（4） C08K009/04（4） C08L079/08（4）
发明人 ALKA A（2） ALKAN A（2） ALKANE A（2）
BAYER A（2） CADALBERT A（2） DALBERT A（2）
HOFFMANN B（2） HU N（2） HU N X（2）
KATO T（2） KITAO A（2） LEE J（2）
SUZUKI K（2） TAMAKI E（2） WATANABE D（2）
公开年 2021（32） 2022（9） 2020（3）
申请年 2020（44）
专利权人 KANEKA CORP（3） CANON KK（2） EMSCHEM AG（2） TORAY IND IN.（2）
XEROX CORP（2）

Polyamide molding composition used as a filled polyamide molding for producing moldings or components of automotive sector, comprises partially crystalline and aromatic polyamide, functionalized impact modifier, metallocene, and additive.

ALKAN A, CADALBERT A, BAYER A, HOFFMANN B, ALKANE A, DALBERT A, ALKA A

Polyamide molding compound used for forming e.g. component of engine compartment of automotive application, comprises partially crystalline, partially aromatic polyamide and/or caprolactam-containing polyamide, filler, optionally substituted metallocene, and additive.

ALKAN A, CADALBERT A, BAYER A, HOFFMANN B, ALKA A, ALKANE A, DALBERT A

Heat-dissipating material used in electrical devices, comprises resin, and graphene having preset average thickness, and has preset nitrogen to carbon ratio as measured by X-ray photoelectron spectroscopy.

KATO T, TAMAKI E

Thermoplastic polyolefin composition for slush and rotary-molded article e.g., interior component of automotive vehicle, comprises olefin-block copolymer, polypropylene copolymer, adhesion promoter, sulfur-free stabilizer additive and talc.

FARRAR G J, REDDY M M

Expandable vinyl chloride resin particle useful in foamed particles for foamed molded product for e.g. heat insulating material applications for building, ceiling material, and core material, comprises carbon-based radiation heat transfer inhibitor, vinyl chloride resin and physical foaming agent.

NEIWA Y, KUTSUMIZU R, TANAKA K

Conductive powder used for forming coating material for forming electrode, comprises conductive polymer powder containing (pi)-conjugated conductive polymer and polyanion, and graphene.

MATSUBAYASHI S, TAKEZAWA Y

Conductive paste composition for conductive film composition for secondary battery, contains polymer component, resin particles, conductive material, and liquid medium, where resin particles are composed of outer shell made of thermoplastic resin and organic compound contained in them.

BIZEN R, YAMAUCHI T, AOKI T

Composition used in coating film for substrate, heat exchanger, and plasma etching processing facility, comprises fluorine-containing polymer containing unit based on fluoroolefin and unit having crosslinkable group, heat conductive filler and curing agent.

TERADA T, HASEGAWA T, HOSODA T

Cation exchange resin for production of high-purity ultrapure water comprises carbon material.

ADACHI T

New ionic organic compound for nano carbon-material dispersion liquid, composite solid and for manufacturing the nanocarbon-material film.

MATSUSAWA Y, KOTOKU H