国家/地区 世界知识产权组织（15）
IPC部 C（15）
IPC大类 C08（15）
IPC小类 C08G（15） C08L（11） C08K（9）
C08J（8） C01B（3） B01D（2）
B32B（2） C09D（2）
IPC C08G073/10（15）
发明人 LEE K N（3） CHUN J（2） JEON J（2）
TOUR J M（2） WON D Y（2）
公开年 2022（3） 2023（3） 2019（2） 2021（2）
申请年 2022（4）  2019（3）  2015（2）  2021（2） 
专利权人 PI ADVANCED .（4） SKCKOLON PI .（2） UNIV RICE WI.（2） UNIV RICE WI.（2）

Producing polyimide powder used in display, automobile, medical, battery, and aerospace, involves preparing polyamic acid solution, preparing polyimide mixed solution by heating polyamic acid solution, and filtering and drying precipitate present in mixed solution to obtain polyimide powder.

LEE H S, YANG M S, LEE I S, LEE H, YANG M

Polyimide film is obtained by imidization reaction of polyamic acid containing quinoline and beta-picoline as imidation catalyst and acetic anhydride as dehydrating agent.

JUNG H, WON D, WON D Y

Polyimide film used in multilayer film and flexible metal clad laminate, is obtained by imidizing polyamic acid solution containing dianhydride component including e.g. biphenyltetracarboxylic dianhydride, and diamine component including e.g. m-tolidine, and comprises graphene nanoplatelets.

JEON J, YEO M, BACK S, LEE K, CHUN J, BAEK S, LEE K N

Polymer composition used in semi-conductors, consumer electronics and industrial constructions, comprises polyetherimide resin, crystalline polyester resin, inherently dissipative polymer, and transesterification inhibitor.

JIANG X, ZHENG Y, CHENG Y

Powder composition for three-dimensional body, comprises predefined amount of polyimide particles having specific average particle size, formed by polymerizing diamine monomer(s) and dianhydride monomers, where polyimide particles material has specific crystallinity and glass transition temperature.

KEMPINSKI K, KERSZULIS J, CHASTAIN J C, DUIS P G, KEMPINSKI K A

Semicrystalline poly(aryl ether ketone) copolymer compositions are used in high pressure and high temperature environment, comprises copolymer having two separate recurring units, first recurring unit and second recurring unit.

WANG Y

Composition for forming composite material, comprises polyaryletherketone copolymer comprising polyetheretherketone containing structural unit and poly(ether diphenyl ether ketone) containing structural unit, and poly(etherimide).

RICH J, ELHIBRI M J, LEACH J, ELHIBRI M

Producing polyimide powder useful for polyimide molded product, comprises dispersing dianhydride compound, diamine compound, and graphene powder in mixed solvent to prepare dispersion, introducing into reactor, and filtering and drying.

LEE K N, CHUN J, JEON J

Polyimide composite film used for electronic component, comprises core layer comprising polyimide resin and graphene, and skin layer comprising another polyimide resin, and has preset electromagnetic wave shielding rate and tensile strength.

LEE K N, KIM K H, KIM K

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H