国家/地区 中国（12） 美国（6） 世界知识产权组织（4） 韩国（3）
IPC部 C（21）
IPC大类 C01（21）
IPC小类 C01B（21）
IPC C01B032/184（21）
发明人 CHEN Y（3） ZHANG S（2） ZHANG Y（2）
公开年 2022（16） 2023（5）
申请年 2022（21）
专利权人 UNIV BARILAN（2）

Preparing secondary enhanced graphene gas gel useful in shoes, comprises introducing substrate layer on prepared graphene gas gel surface, performing chemical vapor deposition reaction and growing sheet layer or spherical graphene aggregate on surface of substrate layer.

ZHENG L, SHEN Y, ZHENG Y, WU L, WANG H

Film forming method involves loading substrate into processing container, forming interface layer having amorphous structure or microcrystalline structure on substrate by plasma of first mixed gas including carbon-containing gas and forming graphene film on interface layer.

NAKAMURA G, TERADA H, MATSUMOTO T, KABUKI N, WADA M, IFUKU R, NAKAMURA K, KAMURAGI N

Device for realizing self-assembling of graphene film based on super-cooling boiling, has heating copper rod that is divided into upper and lower two layers, where upper layer is covered by polytetrafluoroethylene block.

TAO P, SHANG W, DENG T, FU B, CHU B

Coating metal surface with graphene used in organic LED by depositing first graphene molecular precursor on top of metal surface and transforming deposited first graphene molecular precursor into surface bound graphene interfacial layer.

NAVEH D Y

Processing semiconductor for producing high quality devices and structures, involves delivering carbon-containing precursor and hydrogen-containing precursor to processing region of semiconductor processing chamber, forming layer of graphene on substrate positioned in processing region of chamber.

INGLE N K, MALLICK A B, SINGHA R S, WANG J

Method for improving multi-layer graphene coverage rate on copper-based alloy substrate comprises annealing copper base alloy substrate, introducing carbon source to graphene growth after annealing, realizing multi-layer graphene, quickly cooling to room temperature, ending growth.

CHEN Z, XIAO R, YU G, ZHANG Y

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Preparing nanoparticles on a substrate for composite, involves depositing micro-sized particles or salt precursors on a substrate, and applying a rapid, high temperature thermal shock to the substrate and the micro-sized particles or the salt precursors.

YAO Y, CHEN Y, HU L

Chromium-free passivation solution for coating aluminum plate, comprises styrene-acrylic emulsion, epoxy resin, high dispersion graphene dispersant, wetting and dispersing agent, defoaming agent and propylene glycol methyl ether acetate.

YANG L, CHEN H, TONG X

Transferring molecular material to surface involves contacting substrate with solution-synthesized polymer precursors, removing bulk pyrene matrix, and surface-assisted cyclodehydrogenation.

CROMMIE M F, FISCHER F R, BOKOR J, JACOBSE P H, MUTLU Z, MCCURDY R D, VEBER G C, RIZZO D J