国家/地区 中国（7）
IPC部 C（7）
IPC大类 C01（7） H01（7）
IPC小类 C01B（7）
IPC C01B031/04（7）
发明人 LEI T（7）
公开年 2012（7）
申请年 2012（7）
专利权人 UNIV XIDIAN（7）

Preparing structured graphene, comprises cleaning silicon substrate and vacuumizing, introducing propane into the substrate to carbonize, performing heteroepitaxial growth, and cooling the epitaxial cubic silicon carbide film.

DENG P, GUO H, LEI T, ZHANG Y, ZHANG K, ZHANG F

Preparation of structured graphene by depositing silicon dioxide layer on silicon carbide wafer surface, scribing graphics window, reacting carbon tetrachloride with naked silicon carbide, putting wafer on copper film, and annealing.

DENG P, GUO H, LEI T, ZHANG Y, ZHANG K, ZHANG F

Preparation of structured graphene by depositing silicon dioxide layer on silicon carbide surface, etching pattern window, reacting silicon carbide with chlorine, removing silicon dioxide outside window, putting on copper film and annealing.

DENG P, GUO H, LEI T, ZHANG Y, ZHANG K, ZHANG F

Preparation of structural graphene for microelectronic devices, involves growing carbon-silicon carbide thin film and silica layer on substrate, forming nickel film on other sample, placing silica layer on nickel film, and annealing.

DENG P, GUO H, LEI T, ZHANG Y, ZHANG K, ZHANG F

Preparation of structured graphene by growing carbonization zone layer on substrate, growing cubic silicon carbide thin film, depositing silicon dioxide, carving graphics window, and reacting exposed cubic silicon carbide film with chlorine.

DENG P, GUO H, LEI T, ZHANG Y, ZHANG K, ZHANG F

Method for preparing double-layer structural graphene used for manufacturing microelectronic device, involves placing generated double-layer carbon film into buffered hydrofluoric acid solution to remove all silicon dioxide of window.

DENG P, GUO H, LEI T, ZHANG Y, ZHANG K, ZHANG C

Manufacture of graphene on silicon carbide substrate involves producing double-layer carbon membrane, depositing nickel film on silicon substrate, placing carbon surface of double-layer carbon membrane on nickel membrane, and annealing.

DENG P, GUO H, LEI T, ZHANG K, ZHANG Y