国家/地区 中国（96）
IPC部 C（96）
IPC大类 C01（96）
IPC小类 C01B（96）
IPC C01B032/194（96）
发明人 LIU Z（7） GAO C（5） LI Y（5）
LIU Y（5） CHEN Y（4） GUO Y（4）
XU Z（4） ZHANG Y（4） LIU H（3）
LIU J（3） LIU X（3） PAN Z（3）
PANG K（3） WANG J（3） WANG Z（3）
公开年 2022（32） 2021（23） 2020（14） 2023（10） 2018（6） 2019（4） 2013（2） 2015（2） 2017（2）
申请年 2022（29）  2021（25）  2020（14）  2019（11）  2018（4）  2023（4）  2017（3）  2013（2）  2014（2） 
专利权人 AECC BEIJING.（3） UNIV SOUTHWE.（3） UNIV WUHAN T.（3） ANHUI AEROSP.（2）
GUANGDONG MO.（2） HANGZHOU GAO.（2） HARBIN INST .（2） KUANGCHI ADV.（2）
NANOTEK INST.（2） NINGBO GRAPH.（2） SHENZHEN GUA.（2） UNIV LANZHOU（2）
UNIV NORTHWE.（2） UNIV SHANGHA.（2） UNIV SHANGHA.（2） UNIV ZHEJIAN.（2）
WEIHAI YUNSH.（2） XIAMEN KNANO.（2）

Graphene/MXene composite aerogel material has three-dimensional porous structure and MXene sheet layer attached to thin graphene sheet.

LIU C, ZHANG P, LEI D, LIU J, LI Y

Heating rod for use in intelligent heating barrel, has graphene heating film coated on periphery of insulating column, and conductive layer not completely covered on graphene of heating film and connected with power supply through lead.

CHAO W, ZHAO X

Preparing graphene heat dissipation film, involves obtaining graphite dispersion, adding liquid resin and film-forming agent into mixed dispersion, placing graphite conductive sheet in sulfuric acid solution, adding liquid resin into graphene water dispersion solution and peeling off metal substrate.

HONG J, YE J, LIU M, HUANG W, LIN J

High-strength graphene heat-conducting gasket in thermal interface material field, has stacking direction of graphene heat-conducting layer is perpendicular to stacking direction of graphene film in any layer of graphene heat-conducting layer.

WANG H, FANG X, SUN A, YANG S, CAO Y

Method for preparing high-conductivity nanometer graphene colloid useful in field of printed circuit board involves mixing nano-graphene material with additive, dissolving in water, and performing ball milling and ultrasonic dispersion treatment.

ZHAO Y, CHAI X, HU C, YANG G

Activation method before metallization of thick copper printed circuit board hole involves preparing graphene liquid and graphene oxide liquid, mixing to obtain graphene copper plating pre-activation liquid without dispersant, and injecting activating solution.

BAI J, XIE D, FANG B, WANG J

High elastic graphene composite aerogel used in e.g. sensing application, is formed by connecting multiple metal chloride intercalation graphene nano-wall.

GAO C, PANG K, LIU X

Preparing a three-dimensional lightweight graphene shielding material useful in electromagnetic shielding device, comprises e.g. performing aqueous dispersion treatment to the graphene and dispersant to obtain dispersion slurry, mixing the dispersion slurry and aqueous polymer to obtain mixed slurry.

LI Y, BAI H, YANG W

Preparing fluorinated graphene used as composite heat-conducting film, involves uniformly mixing oxidized graphene with polyvinylidene fluoride, calcining under protection of inert gas, and carrying out fluorination reaction.

GUO S, WANG X, ZHANG L, LIU Y, YUAN X, ZHANG G, HUO J

Preparing graphene composite copper heat-conducting film comprises adding graphene oxide into water, stirring to obtain graphene oxide slurry, adding copper sulfate solution, coating graphene oxide-copper sulfate composite slurry on substrate, heat-treating, sintering composite nano-copper film.

PAN Z, ZHOU M