国家/地区 中国（56）
IPC部 C（56）
IPC大类 C08（56） C09（12） B29（5）
D01（5） B32（4） B33（4）
C01（2） G02（2） H01（2）
H05（2）
IPC小类 C08G（56）
IPC C08K003/36（56）
发明人 WEN Y（7） WANG L（5） WANG X（4）
CHENG X（3） WANG S（3） DENG H（2）
FAN Y（2） HAN Y（2） HU C（2）
HUANG B（2） HUANG W（2） LI G（2）
LI Q（2） LIN W（2） QIU S（2）
公开年 2018（14） 2021（11） 2022（9） 2017（6） 2016（4） 2020（4） 2023（4） 2019（2）
申请年 2016（11）  2021（11）  2017（9）  2019（7）  2020（5）  2022（5）  2018（3）  2023（2） 
专利权人 HENAN HAINAD.（6） CHONGQING JI.（2） GUANGDONG JO.（2） NINGXIA QING.（2）
SHANDONG BEN.（2） UNIV FUZHOU（2） ZHEJIANG INS.（2）

High-barrier heat-resistant solvent-free polyurethane composite material useful as film lamination in packaging composite field of e.g. daily chemical, comprises e.g. polyurethane prepolymer, graphene modified polyol, polyester polyol, nano-silicon dioxide modified polyether polyol and isocyanate.

HE C, TIAN L, WEN Y

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Polymer layer derived composition useful in a display device, comprises e.g. polyborondimethylsiloxane, benzoyl peroxide, fumed silica, glass fibers, glass powder, carbon nanotubes, graphene oxide, carbonyl iron, calcium carbonate, zinc oxide, silicone elastomer and polydimethylsiloxane.

HWANG S, LEE J, WU X, KIM J, KIM Y, SHIN H, YU W, YU W R, SHIN H J, SONG K Y, KIM J S, OH H J

Preparing nanoparticle-modified resin matrix based on direct ultrasonic dispersion method useful for resin or composite material forming, comprises e.g. adding curing agent to main resin, adding nanoparticles, immersing ultrasonic horn in resin mixture, and dispersing nanoparticles.

MA Z, FENG Z, YANG Y, LI L

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

Polyvinyl chloride pipe useful for e.g. water supply of tap water, comprises polyvinyl chloride resin, talc powder, calcium-zinc stabilizer, silicon dioxide, lubricant, titanium dioxide, ethylene-methyl methacrylate copolymer, solid plasticizer, aging-resistant filler and impact modifier.

XU R, WANG Y

Thermoplastic polyurethane elastomer useful for charging pile sheath comprises isocyanate, polyol compounds, nano-filler, protective agent and compatibilizer.

XU Z, ZHANG X, LONG S, CAI J

Manufacture of high heat-resistant ultra-low expansion polyimide film for e.g. electronics, microelectronics , optical display or optical communication field, by mixing raw material with solvent, filtering, vacuum defoaming, uniformly coating, and peeling substrate.

QIAN X, LIAO B, ZHANG B

Modified epoxy resin useful as electric material, electronic material, matrix and coating for building material,.

LV S, LU Z, WU J, LIN J