国家/地区 中国（10） 美国（2）
IPC部 C（11） B（2）
IPC大类 C08（11） C09（4） B32（2）
IPC小类 C08G（11）
IPC C08K003/38（11）
发明人 LIU S（2） MA Y（2） XU G（2）
YUAN Y（2） ZHAO J（2）
公开年 2021（9） 2020（2）
申请年 2020（11）
专利权人 UNIV SOUTH C.（2）

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

Polymeric material for two-portion composition, comprises a polymerized reaction product of a polymerizable composition comprising components, where components comprises a uretdione-containing material.

WHITE K L, YAO L, RULE J D, KRYGER M J, KROPP M A

Preparation of discontinuous fiber-reinforced polyhexahydrotriazine resin-based thermally-conductive composite material involves prepolymerizing formaldehyde and aromatic amine, mixing with discontinuous fibers to obtain prepreg, and curing.

YUAN Y, MA Y, ZHAO J, LIU S

Preparing flame-retardant epoxy resin composite material with simultaneous microwave peeling and intercalation of organically modified nano two-dimensional materials comprises mixing two-dimensional material and deionized water.

WU Z, DU J, GUO J, FAN Q

Preparing continuous fiber reinforced polyhexahydrotriazine resin-based thermally conductive composite material e.g. comprises dissolving formaldehyde and aromatic amine in water/non-proton solvent mixed solution and then pre-polymerizing.

YUAN Y, MA Y, ZHAO J, LIU S

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Thermoplastic polyurethane includes diisocyanate, polyol, tourmaline, porous graphene, chain extender, catalyst and other auxiliary agent.

CHEN H, XU Y, SONG X, GAO Z, GUAN Y, WANG Z

Heat-resistant composite dielectric material comprises epoxy resin as substrate, and benzoxazine additive curing, and boron nitride nano sheet and fluorinated graphene as filler, by stripping hexagonal boron nitride into nano-sheet.

REN J, QIU Y, QING Q, BAO P, XU G

Hot melt prepreg processing borosilicate phenolic resin comprises phenol, aldehyde, boron-containing compound, silicate, modifier and toughening agent, modifier, and toughening agent.

YAO Y, WEI X, LIU J, WANG L, LIU H, TIAN M

Thermally conductive connection foam comprises polycarbonate diol, xylylene diisocyanate, vinylpolysiloxane, graphene oxide, pentaerythritol, polyethyleneimine, N-phenyl-2-naphthylamine, foaming agent, curing agent and flame retardant.

ZHENG C, LIANG X